Abstract: A technique is disclosed for the mechanical removal of elastomeric encapsulants from integrated circuits. The encapsulant to be removed is outlined by cutting, and the outlined area is cooled sufficiently either during or subsequent to cutting such that the encapsulant may be removed by gripping one edge with tweezers and peeling from the circuit.

Abstract: Disclosed is a method of encapsulating integrated circuit chips formed on an insulating substrate which permits complete filling of areas under the chip. The encapsulant employed is a dispersion of a material, such as a silicone elastomer, which cures by reaction with water vapor. Subsequent to application of the encapsulant over and under the chip, the solvent of the dispersion is evaporated during a pre-cure treatment by means of a dry ambient of less than 5% relative humidity which suppresses crosslinking. After essentially all the solvent is thus removed, the encapsulant is cured by exposure to a second ambient of higher relative humidity which enhances crosslinking.