Patents by Inventor Nicholas Boynton

Nicholas Boynton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heterogeneous integration of an electro-optical platform
    Patent number: 11675126
    Abstract: A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide, and at least one III-V die is bonded to the exposed buried oxide. In embodiments, at least one waveguiding component is fabricated in the SiP functional layer. In embodiments, the SiP functional layer comprises a top waveguiding layer.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: June 13, 2023
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Ashok Kodigala, Anthony L. Lentine, Nicholas Boynton, Douglas Chandler Trotter, Thomas A. Friedmann, Phillip Harrison Weiner
  • Heterogeneously integrated electro-optic modulator
    Patent number: 10788689
    Abstract: In an electro-optical modulator, an electro-optical modulation layer is bonded to a cladding layer that overlies a substrate. A modulation zone waveguide is optically coupled to the electro-optical modulation layer and optically coupled to an I/O waveguiding structure embedded in the cladding layer. The I/O waveguiding structure is conformed to guide input light toward the modulation zone waveguide and to guide output light away from the modulation zone waveguide.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 29, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Anthony L. Lentine, Christopher DeRose, Douglas Chandler Trotter, Thomas A. Friedmann, Michael Gehl, Nicholas Boynton