Abstract: A switch has a first input to couple to an AC electrical power source, a second input to couple to a DC electrical power source, and an output to couple to an electrical power load. A control module transmits a signal to the electrical power load to determine whether the electrical power load uses AC electrical power or DC electrical power, and receives in response thereto an indication that the electrical power load uses one of AC electrical power and DC electrical power. The control module then transmits a signal to the switch to configure the switch to receive electrical power from one of the AC electrical power source and the DC electrical power source and transmit the received electrical power to the electrical power load, responsive to the received indication.

Abstract: An apparatus includes switch that has a first input coupled to an AC electrical power source, a second input coupled to a DC electrical power source, and an output coupled to an electrical power termination point. The apparatus further includes a control module coupled to the switch, and in communication with the electrical power termination point or an electrical power load coupled to the electrical power termination point to receive an indication that the load operates on or according to one of AC electrical power and DC electrical power. The control module transmits a signal to the switch to cause the switch to receive electrical power from one of the AC electrical power source and the DC electrical power source and transmit the received electrical power to the electrical power termination point, responsive to the received indication.

Abstract: A switch has a first input to couple to an AC electrical power source, a second input to couple to a DC electrical power source, and an output to couple to an electrical power load. A control module transmits a signal to the electrical power load to determine whether the electrical power load uses AC electrical power or DC electrical power, and receives in response thereto an indication that the electrical power load uses one of AC electrical power and DC electrical power. The control module then transmits a signal to the switch to configure the switch to receive electrical power from one of the AC electrical power source and the DC electrical power source and transmit the received electrical power to the electrical power load, responsive to the received indication.

Abstract: A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object.

Abstract: A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).

Abstract: The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the contacts to the peripheral edges of the substrate where one set of ends of a lead frame assembly mates with the conductors. An encapsulation technique is used to encapsulate the device, such that only the other set of ends of the lead frame assembly extends from the package. In an alternative embodiment, the integrated circuit is hermetically sealed by having a hermetic cover disposed over the integrated circuit. In a second alternative embodiment, the substrate is capable of having disposed upon it multiple integrated circuits. The present invention provides for a significant increase of lead count to die size ratio.