Patents by Inventor Nicholas C. Lehman

Nicholas C. Lehman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6872278
    Abstract: An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from ?20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: March 29, 2005
    Assignee: H.B. Fuller Licensing & Financing, Inc.
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Publication number: 20040003893
    Abstract: An adhesive composition that includes a) an emulsion that includes a multistage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Application
    Filed: September 26, 2002
    Publication date: January 8, 2004
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Publication number: 20040003892
    Abstract: An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Application
    Filed: July 8, 2002
    Publication date: January 8, 2004
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Patent number: 6238732
    Abstract: This invention relates to a hot melt adhesive composition in pellet form. The hot melt adhesive composition is pressure sensitive, having a storage modulus, G′, at 25° C., of less than about 5×106 dynes/cm2. The pellets are coated with a pelletizing aid on the surface at a concentration preferably ranging from about 1 wt-% to about 30 wt-%. The pelletizing aid is a hot melt adhesive component or a material which does not substantially adversely affect the adhesive properties.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: May 29, 2001
    Assignee: H. B. Fuller Licensing & Financing Inc.
    Inventors: Janelle C. Cameron, Carolyn A. Fischer, Nicholas C. Lehman, Jeffrey S. Lindquist, Christopher E. Olson, Steve A. Fox
  • Patent number: 6120899
    Abstract: This invention relates to a hot melt adhesive composition in pellet form. The hot melt adhesive composition is pressure sensitive, having a storage modulus, G', at 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2. The pellets are coated with a pelletizing aid on the surface at a concentration preferably ranging from about 1 wt-% to about 30 wt-%. The pelletizing aid is a hot melt adhesive component or a material which does not substantially adversely affect the adhesive properties. The pellets are free-flowing and have a substantially tack-free surface.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: September 19, 2000
    Assignee: H. B. Fuller Licensing & Financing Inc.
    Inventors: Janelle C. Cameron, Carolyn A. Fischer, Nicholas C. Lehman, Jeffrey S. Lindquist, Christopher E. Olson, Steve A. Fox
  • Patent number: 4743498
    Abstract: A novel adhesive comprising an aqueous emulsion of a polymer comprising a vinyl monomer and an alkylacrylamidoglycolate alkyl ether monomer. The polymer in contact with randomly laid fibers can be heat curable at elevated temperature to form an intact nonwoven fabric without the release of substantial amounts of formaldehyde.
    Type: Grant
    Filed: March 31, 1986
    Date of Patent: May 10, 1988
    Assignee: H.B. Fuller Company
    Inventors: Thomas J. Kedrowski, Nicholas C. Lehman