Abstract: A heat exchanger assembly (201) comprises: a hot fluid flow channel (210); a cold fluid flow channel (220); and a heat exchanger (230) disposed between the channels. The heat exchanger comprises a heat sink (240) and a thermoelectric device (250). In some embodiments the fluid flow channels (210, 220) may be arranged to provide a cross-flow of the hot and cold fluids.

Abstract: There is disclosed herein a layer assembly for a heat exchanger, the layer assembly comprising: at least one heat pump module, the module comprising a thermo-electric cooler (TEC) attached to an island formed from a flow-permissive material; a flow-permissive layer provided with an island-reciprocating recess for substantially corresponding to and accommodating the island; a thermal storage layer comprising a heat transfer matrix material charged with a phase-change material, and provided with a TEC-reciprocating recess for substantially corresponding to and accommodating the TEC, wherein the TEC is attached to the thermal storage layer at a surface of the TEC-reciprocating recess, and the flow-permissive layer and the thermal storage layer are arranged such that the island of flow-permissive material extends into the island-reciprocating recess and a separation exists between the island and the flow-permissive layer.

Abstract: A heat exchanger assembly (201) comprises: a hot fluid flow channel (210); a cold fluid flow channel (220); and a heat exchanger (230) disposed between the channels. The heat exchanger comprises a heat sink (240) and a thermoelectric device (250). In some embodiments the fluid flow channels (210, 220) may be arranged to provide a cross-flow of the hot and cold fluids.

Abstract: There is disclosed herein a layer assembly for a heat exchanger, the layer assembly comprising: at least one heat pump module, the module comprising a thermo-electric cooler (TEC) attached to an island formed from a flow-permissive material; a flow-permissive layer provided with an island-reciprocating recess for substantially corresponding to and accommodating the island; a thermal storage layer comprising a heat transfer matrix material charged with a phase-change material, and provided with a TEC-reciprocating recess for substantially corresponding to and accommodating the TEC, wherein the TEC is attached to the thermal storage layer at a surface of the TEC-reciprocating recess, and the flow-permissive layer and the thermal storage layer are arranged such that the island of flow-permissive material extends into the island-reciprocating recess and a separation exists between the island and the flow-permissive layer.

Abstract: The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.

Abstract: Convection cooling channels are provided by means of an at least partially enclosed open cell metal foam structure for removing heat from equipment. In particular, an electronic equipment box is provided having walls comprising sections of open cell aluminium foam, clad with aluminium, through which air or other types of coolant may pass to remove heat from heat-generating components mounted thereon. Other types of equipment, such as electric motors, may be surrounded by customised sections of open cell metal foam, appropriately clad, through which a coolant may be channeled. The foam cell size may be adjusted according to desired coolant flow rate and weight considerations. Convection cooling structures may be combined with latent heat storage bodies comprising similar open cell metal foam structures containing wax, operating in tandem with the present convection cooling structures in a heat management solution.

Abstract: The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.

Abstract: In a thin film circuit, high values of resistance/surface area can be attained by forming the resistive material as a mesh rather than a solid block. The advantages of this are that it gives a high resistance value in a small area and allows laser trimming, both without adversely affecting resistor characteristics such as stability.