Abstract: An apparatus includes an optical interposer including a first surface, a first mating protrusion extending outwardly from the first surface, and two or more alignment protrusions extending outwardly from the first surface. The first mating protrusion is to be partially disposed within a first recess formed in a second surface of a photonic integrated circuit (PIC) die when the first surface of the optical interposer opposes the second surface of the PIC die and respective distal surfaces of the two or more alignment protrusions contact the second surface of the PIC die. A first portion of an outer surface of the first mating protrusion is to contact a first side wall of the first recess and a second portion of the outer surface of the first mating protrusion is to oppose a second side wall of the first recess such that a second space is to be defined therebetween.

Abstract: In one embodiment, a device includes a fiber array unit (FAU) coupled to a photonics integrated circuit (PIC) die. The PIC die includes a cavity defined at an edge of the PIC die, with outer edges of the cavity being formed at an angle less than 90 degrees with respect to a bottom surface of the cavity. The PIC die further includes first waveguides protruding into the cavity of the PIC die. The FAU includes a shelf portion extending from a body portion, and a plurality of second waveguides protruding from an outer edge of the shelf portion opposite the body portion. The FAU further includes alignment structures on outer edges of the shelf portion that are in contact with the angled edges of the cavity of the PIC die.

Abstract: Technologies for hybrid optical chip-to-chip coupling are disclosed. In an illustrative embodiment, light from a waveguide in a photonic integrated circuit (PIC) die is collimated using a micromirror and directed towards a glass substrate. Another micromirror in the glass substrate focuses the light into a waveguide defined in a bulk layer of the glass substrate. In the illustrative embodiment, the waveguide is directly written into the bulk layer using an ultrafast laser. The glass substrate also has waveguides with a large difference in the index of refraction in a layer above the bulk substrate, such as silicon nitride waveguides in silicon oxide cladding. The directly-written waveguides can be evanescently coupled to the silicon nitride waveguides. The silicon nitride waveguides can then be used for two-dimensional routing throughout the glass substrate. The light can be coupled back into a directly-written waveguide before it is transmitted to another PIC die.

Abstract: A kinematically aligned optical connector may be implemented with a silicon PIC component and a glass substrate component. The kinematically aligned optical connector includes one or more kinematic connectors or mechanical alignment features and visual fiducials that enable true kinematic coupling (i.e., in a three-dimensional Cartesian coordinate system, full constraint in all 6 degrees of freedom, meaning, X, Y, Z planes and all 3 angles), and enables an increased thickness of the glass substrate material of the glass waveguide substrate.

Abstract: An optical interconnect component for use in transmitting light between a photonic integrated circuit and one or more optical fibres attached to an optical fibre connector ferrule is disclosed. The optical interconnect component comprises a step formed at an edge of the optical interconnect component, the step including a ledge and a facet, one or more optical beam management elements formed in a surface of the optical interconnect component, and a plurality of integrated optical waveguides. Each of two or more of the integrated optical waveguides extends from the facet so as to define a plurality of optical ports at the facet, and each of the one or more optical beam management elements is aligned with, but separated from, an end of a corresponding one of the plurality of integrated optical waveguides.

Abstract: An optical interconnect arrangement for use in transmitting light between a photonic integrated circuit and a plurality of optical fibres, comprises a plurality of primary optical beam management elements, a plurality of secondary optical beam management elements, and a plurality of optical fibre alignment structures. Each optical fibre alignment structure is configured to receive a corresponding optical fibre so that the end of the corresponding optical fibre is aligned with, but separated from, a corresponding one of the secondary optical beam management elements, and the optical interconnect arrangement defines a plurality of optical paths, each optical path extending from a surface of the optical interconnect arrangement to the end of a corresponding one of the optical fibre alignment structures via a corresponding one of the primary optical beam management elements and a corresponding one of the secondary optical beam management elements.

Abstract: The present application relates to a method for modifying a substrate, which comprises generating a pulsed laser beam comprising a train of laser pulses, the train of laser pulses including at least three consecutive laser pulses, and controlling a direction of the pulsed laser beam and/or a position of the substrate from laser pulse to laser pulse so that the at least three consecutive laser pulses sequentially irradiate at least three regions of the substrate according to a predetermined spatial sequence which defines the relative spatial positions of the at least three regions of the substrate and the order of irradiation of the at least three regions of the substrate. The present application relates also to an apparatus (100) for modifying a substrate (108). The method and apparatus (100) may be used, in particular though not exclusively, for forming an optical device.

Abstract: An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising a monolithic block of material, one or more fiber alignment structures formed in the material of the monolithic block, each fiber alignment structure comprising a groove configured to accommodate a corresponding optical fiber, and one or more apparatus alignment features formed in the material of the monolithic block, wherein the one or more apparatus alignment features are additional to the one or more fiber alignment structures and wherein the one or more apparatus alignment features have a known spatial relationship relative to the one or more fiber alignment structures. The one or more apparatus alignment features may enable passive alignment of the apparatus relative to a member which is separate from the apparatus such as an optical component and/or a photonic chip.

Abstract: An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising material, and one or more fiber alignment structures defined in the material of the body. Each fiber alignment structure comprises a groove and a corresponding passage. The groove and the corresponding passage are arranged end-to-end. Each fiber alignment structure is configured to accommodate a corresponding optical fiber extending along the groove and the corresponding passage. The groove of each fiber alignment structure may serve or help to guide an end of a corresponding fiber into the corresponding passage during assembly. The groove of each fiber alignment structure may help to support the end of the corresponding optical fiber. The groove of each fiber alignment structure can assist with maintaining a position of the corresponding optical fiber when ribbonised or non-ribbonised optical fiber is used.

Abstract: An apparatus for positioning one or more optical fibers relative to the apparatus, comprises a body comprising material, and one or more fiber alignment structures defined in the material of the body, wherein each fiber alignment structure is configured to accommodate a corresponding optical fiber, and wherein each fiber alignment structure is configured to induce one or more bends along the corresponding optical fiber. When an optical fiber is located in such a fiber alignment structure, the optical fiber may be forced into contact with the fiber alignment structure in one or more known regions so that the corresponding optical fiber is located at a more predictable position relative to the corresponding fiber alignment structure in the one or more known regions than is the case for known fiber alignment structures.

Abstract: In one embodiment, an integrated circuit device includes a substrate, an electronic integrated circuit (EIC), a photonics integrated circuit (PIC) electrically coupled to the EIC, and a glass block at least partially in a cavity defined by the substrate and at an end of the substrate. The glass block defines an optical path with one or more optical elements to direct light between the PIC and a fiber array unit (FAU) when attached to the glass block.

Abstract: Technologies for beam expansion for vertically-emitting photonic integrated circuits are disclosed. In the illustrative embodiment, waveguides in a photonic integrated circuit (PIC) die guide light to vertical couplers, which direct the light from the waveguides out of the top surface of the PIC die. A glass microoptic substrate is mounted on the top surface of the PIC die, positioned over the vertical couplers. A mirror in the glass microoptic substrate reflects the light from the vertical couplers to propagate in a direction parallel to the top surface of the PIC die. Another set of mirrors in the glass microoptic substrate focus the light from each waveguide into a collimated beam directed out of the top surface of the glass microoptic substrate.

Abstract: A photonic device, an integrated circuit device assembly including the photonic device, and a method of fabricating the photonic device. The device includes: a substrate; photonic circuitry on the substrate; an optical waveguide structure on the substrate; an optical coupler coupled to the photonic circuitry at one end thereof by way of the optical waveguide structure, and having a terminus at another end thereof to output an optical beam; and a metalens structure on the substrate, the metalens structure including a plurality of vertical nanostructures to configure an optical path between the optical coupler and an optical interface component that is to be optically coupled to the photonic device.

Abstract: Technologies for beam expansion in glass substrates are disclosed. In the illustrative embodiment, light in a waveguide defined in a glass substrate is allowed to expand towards a curved mirror defined in the glass substrate. The light is collimated to a beam as it is reflected off the mirror. In the illustrative embodiment, the light is reflected upwards toward the top surface of the glass substrate. A photonic integrated circuit (PIC) die may be mounted on the glass substrate. A micromirror lens fixed to the PIC die can focus the collimated beam into a waveguide defined in the PIC die. In some embodiments, an interface for an optical connector may be formed in the glass substrate, allowing the optical connector to be removably plugged into the glass substrate.

Abstract: An optical apparatus (10) for routing an optical signal (12) comprises a body (14) comprising a material. A waveguide (16) is formed in the body (14) by laser modification of the material. The optical apparatus (10) further comprises a region (18) comprising a lower refractive index than the material of the body (14) and defines an interface (24) between the region (18) and the waveguide (16). The waveguide (16) and the interface (24) are aligned relative to each other for routing the optical signal (12) therebetween and reflecting the optical signal (12) at the interface (24).

Abstract: Optical apparatus and methods of manufacture thereof An optical apparatus (20) for evanescently coupling an optical signal across an (interface (30) is described. The optical apparatus (20) comprises a first substrate (22) and a second substrate (24). The optical signal is evanescently coupled between a first waveguide (26) formed by laser inscription of the first substrate (22) and a second waveguide (28) of the second substrate (22). The first waveguide (26) comprises a curved section (34) configured to provide evanescent coupling of the optical signal between the first and second waveguides (26, 28) via the interface (30).

Abstract: A method of forming an optical device in a body (32), comprises performing a plurality of laser scans (34,36) to form the optical device, each scan comprising relative movement of a laser beam and the body thereby to scan the laser beam along a respective path (34a, 34b 34f; 36a, 36b 36f) through the body to alter the refractive index of material of that path, wherein the paths are arranged to provide in combination a route for propagation of light through the optical device in operation that is larger in a direction substantially perpendicular to the route for propagation of light than any one of the paths individually.

Abstract: Optical apparatus comprises: a body comprising material; a plurality of optical elements formed of the material of the body; and a plurality of alignment holes formed in the material of the body, wherein: the alignment holes comprise fibre or other waveguide alignment holes aligned with one or more of the optical elements, and/or the alignment holes comprise alignment holes configured to receive mechanical elements for fixing and/or aligning the body to at least one further body.

Abstract: Optical apparatus and methods of manufacture thereof An optical apparatus (20) for evanescently coupling an optical signal across an (interface (30) is described. The optical apparatus (20) comprises a first substrate (22) and a second substrate (24). The optical signal is evanescently coupled between a first waveguide (26) formed by laser inscription of the first substrate (22) and a second waveguide (28) of the second substrate (22). The first waveguide (26) comprises a curved section (34) configured to provide evanescent coupling of the optical signal between the first and second waveguides (26, 28) via the interface (30).

Abstract: An optical apparatus (10) for routing an optical signal (12) comprises a body (14) comprising a material. A waveguide (16) is formed in the body (14) by laser modification of the material. The optical apparatus (10) further comprises a region (18) comprising a lower refractive index than the material of the body (14) and defines an interface (24) between the region (18) and the waveguide (16). The waveguide (16) and the interface (24) are aligned relative to each other for routing the optical signal (12) therebetween and reflecting the optical signal (12) at the interface (24).