Abstract: A fabric-based item may include fabric formed from intertwined strands of material such as intertwined strands of tubing. The strands of material may include electrophoretic ink formed from charged nanoparticles of different colors in fluid. The electrophoretic ink may be contained within strands of tubing or may be enclosed within encapsulation structures such as encapsulation spheres. Encapsulation spheres or other encapsulation structures may be embedded in clear polymer binder within tubing or other strands. Electroluminescent particles may be included in the clear polymer binder. Electric fields can be applied to the electrophoretic ink in a given area of the fabric using conductive strands that overlap the area, using conductive electrodes such as transparent conductive electrodes on strands of tubing, using coaxial electrodes, or using other electrode structures.

Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

Abstract: A fabric-based item may include fabric formed from intertwined strands of material such as intertwined strands of tubing. The strands of material may include electrophoretic ink formed from charged nanoparticles of different colors in fluid. The electrophoretic ink may be contained within strands of tubing or may be enclosed within encapsulation structures such as encapsulation spheres. Encapsulation spheres or other encapsulation structures may be embedded in clear polymer binder within tubing or other strands. Electroluminescent particles may be included in the clear polymer binder. Electric fields can be applied to the electrophoretic ink in a given area of the fabric using conductive strands that overlap the area, using conductive electrodes such as transparent conductive electrodes on strands of tubing, using coaxial electrodes, or using other electrode structures.

Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.

Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.

Abstract: An electronic device may have front and rear surfaces. A front-facing camera may be formed on the front surface and a rear-facing camera may be formed on the rear surface. A display may be mounted on the front face of the electronic device. The cameras may nominally point along axes that run parallel to surface normals for the front and rear surfaces. A removable camera accessory with reflector structures may be mounted over a camera to deflect light and thereby point the camera in an off-axis direction. The removable camera accessory may be supported in a stand or other support structure. Magnetic structures and other structures may be used in coupling the electronic device to the support structures and may be used in coupling the camera accessory to the electronic device.

Abstract: An electronic device may include subassemblies such as battery structures, electromagnetic shielding structures, and button structures. The electromagnetic shielding structures may include a conductive fence and a flexible shielding layer that covers electronic components. The electromagnetic shielding structure may be formed with a recess that receives a protruding portion of a battery. The recess may be formed from a multi-level shielding structure that includes rigid and flexible portions. The button structures may be mounted to a ledge that is formed as an integral part of a device housing. An electronic device battery may be enclosed in a protective battery sleeve. The battery sleeve may include a center portion that encloses the battery and peripheral portions that are folded and coupled to the center portion by adhesive material interposed between opposing surfaces of the folded peripheral portions and the center portion of the battery sleeve.

Abstract: An electronic device may be provided with a display and wireless circuits. The wireless circuits may include antenna structures and radio-frequency transceiver circuitry that transmits and receives radio-frequency signals using the antenna structures. A ground plane for the antenna structures may be located in the center of the electronic device under the display. A resonating element may be used to reduce signal interference that otherwise arises when simultaneously operating the display and the antenna structures. The resonating element may be implemented using an L-shaped structure have an arm that extends parallel to one of the edges of the display.

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness ma be adjusted to adjust antenna performance.

Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.

Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness ma be adjusted to adjust antenna performance.

Abstract: A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). In one embodiment, a molded acoustic chamber can be formed to assist in directing audio sound between an opening an outer housing and an internal flexible electronic substrate. The audio element can be mounted on or coupled to the flexible electrical substrate over an opening therein that allows allow audio sound to pass there through. The molded acoustic chamber can also be formed such that it includes a barrier, such as a mesh barrier, so that undesired foreign substances can be blocked from entry or further entry into the audio chamber. The molded acoustic chamber can also be formed such that it includes one or more acoustic seals that can be used to provide an acoustic seal between the molded acoustic chamber and the opening in the outer housing.

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss.

Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. A conductive path may be formed that connects the peripheral conductive housing member and the internal ground plane. The conductive path may include a flex circuit. The flex circuit can include a solder flow barrier to constrain flow of solder. A metal structure may be welded to the peripheral conductive housing member. A solder pad and other traces in the flex circuit may be soldered to the metal structure at one end of the conductive path. At the other end of the conductive path, the flex circuit may be attached to the ground plane using a bracket, screw, and screw boss.

Abstract: Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness may be adjusted to adjust antenna performance.