Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with an ultrasonic transmitter or ultrasonic transceiver having an electrode layer divided into a plurality of electrode segments. The ultrasonic fingerprint sensor system may detect an object over one or more electrode segments and provide a voltage burst to one or more selected electrode segments for localized generation of ultrasonic waves. The localized generation of ultrasonic waves may facilitate localized readout for imaging. In some implementations, the voltage burst may be provided in a single-ended drive scheme or differential drive scheme.

Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.

Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a flexible substrate. The ultrasonic fingerprint sensor system may include a film stack disposed on the flexible substrate that provides acceptable acoustic coupling for fingerprint sensing. The ultrasonic fingerprint sensor system includes a high acoustic impedance layer in an acoustic path of ultrasonic waves through a display. The high acoustic impedance layer can be electrically conductive or electrically nonconductive. In some implementations, the ultrasonic fingerprint sensor system includes an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

Abstract: Disclosed are methods, devices, apparatuses, and systems for an under-display ultrasonic fingerprint sensor. A display device may include a platen, a display underlying the platen, and an ultrasonic fingerprint sensor underlying the display, where the ultrasonic fingerprint sensor is configured to transmit and receive ultrasonic waves via an acoustic path through the platen and the display. A light-blocking layer and/or an electrical shielding layer may be provided between the ultrasonic fingerprint sensor and the display, where the light-blocking layer and/or the electrical shielding layer are in the acoustic path. A mechanical stress isolation layer may be provided between the ultrasonic fingerprint sensor and the display, where the mechanical stress isolation layer is in the acoustic path.

Abstract: This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit. Methods of forming ultrasonic sensors include bonding piezoelectric receiver layers to TFT arrays.

Abstract: Disclosed are methods, devices, apparatuses, and systems for poling a piezoelectric film. A poling system can be a corona poling system including a corona source with one or more corona wires configured to transfer a corona discharge onto a major surface of the piezoelectric film. The poling system can further include a grid electrode interposed between the corona source and the piezoelectric film. A substrate including the piezoelectric film may be supported on a substrate support, where the substrate and the corona source are configured to move relative to each other during poling.

Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.

Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.

Abstract: An apparatus may include an ultrasonic receiver array, an ultrasonic transmitter and a control system capable of controlling the ultrasonic transmitter to transmit first ultrasonic waves in a first direction and to simultaneously transmit second ultrasonic waves in a second direction that is opposite the first direction. The control system may be capable of distinguishing first reflected waves from second reflected waves, the first reflected waves corresponding to reflections of the first ultrasonic waves that are received by the ultrasonic receiver array and the second reflected waves corresponding to reflections of the second ultrasonic waves that are received by the ultrasonic receiver array. The control system may be capable of determining first image data corresponding to the first reflected waves and of determining second image data corresponding to the second reflected waves.

Abstract: A package may include a substrate and a semiconductor die with the substrate having a smaller width than the semiconductor die and encapsulated in a mold compound. In one example, the package may be a wafer level package that allows an external connection on the backside of the package to enable manufacturing in a panel or wafer form.

Abstract: Various techniques and apparatuses are disclosed that provide for pixelated display modules that integrate an ultrasonic fingerprint or biometric sensing capability. In some implementations, the ultrasonic fingerprint sensor and the display components of the display module may share a common backplane. In some implementations, the ultrasonic fingerprint sensor may share a flex cable with other components in the display module. In some implementations, the ultrasonic fingerprint sensor may leverage conductive traces on a cover glass used to provide for touch input to the display module.

Abstract: Embodiments of an ultrasonic button and methods for using the ultrasonic button are disclosed. In one embodiment, an ultrasonic button may include an ultrasonic transmitter configured to transmit an ultrasonic wave, a piezoelectric receiver layer configured to receive a reflected wave of the ultrasonic wave, a platen layer configured to protect the ultrasonic transmitter and the piezoelectric receiver layer, a first matching layer configured to match an acoustic impedance of the platen layer with an acoustic impedance of ridges of a finger, and an ultrasonic sensor array configured to detect the finger using the reflected wave.

Abstract: A touch sensor may include a digital resistive touch (DRT) sensor architecture that is substantially free of air gaps. The DRT touch sensor may include a layer of force-sensitive resistor (FSR) material on an array of row and column electrodes. The electrodes may be formed on a substantially transparent substrate. Near the intersection of each row and column, one or more thin transparent patterned conductive bridges may be situated above the FSR. The conductive bridges may be configured for electrical connection with row and column electrodes when force is applied to the conductive bridge or surface of the touch sensor. Some touch sensors may include both DRT and projected capacitive touch (PCT) functionality.

Abstract: This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.

Abstract: Various techniques and apparatuses are disclosed that provide for pixelated display modules that integrate an ultrasonic fingerprint or biometric sensing capability. In some implementations, the ultrasonic fingerprint sensor and the display components of the display module may share a common backplane. In some implementations, the ultrasonic fingerprint sensor may share a flex cable with other components in the display module. In some implementations, the ultrasonic fingerprint sensor may leverage conductive traces on a cover glass used to provide for touch input to the display module.

Abstract: This disclosure provides systems, methods and apparatus related to an ultrasonic sensor for detecting ultrasonic energy. In some implementations, the ultrasonic sensor includes a piezoelectric receiver layer bonded with an adhesive to an array of pixel circuits disposed on a substrate, each pixel circuit in the array including at least one thin film transistor (TFT) element and having a pixel input electrode electrically coupled to the pixel circuit. Methods of forming ultrasonic sensors include bonding piezoelectric receiver layers to TFT arrays.

Abstract: A separate control system may be configured for a combined sensor device. Alternatively, at least part of the control system may be included in another device, such as a processor of a mobile device. Software for handwriting, touch and fingerprint detection may be included in the control system. Low, medium and high resolution may be obtained with a single combined sensor device by scanning a subset of the sensels, or by aggregating lines or columns. Power consumption may be reduced by aggregating sensor pixels (or rows or columns) electrically using the controller, so that they perform as a low power small array until higher resolution with a larger array is needed. Power consumption may be reduced by turning off portions or all of the sensor device, turning off parts of the control system, and/or employing first-level screening at a reduced frame rate.

Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.