Patents by Inventor Nicholas J. Furman

Nicholas J. Furman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11924983
    Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: March 5, 2024
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Ryan J. Eickbush, Neiko P. Levenhagen, Christopher Scott Marchman, Steven Patterson, Nicholas J. Furman
  • Publication number: 20230300996
    Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Inventors: Ryan J. Eickbush, Neiko P. Levenhagen, Christopher Scott Marchman, Steven Patterson, Nicholas J. Furman
  • Patent number: 11728574
    Abstract: A base configured to be joined with other bases to form a substrate for an antenna array comprises a body, a plurality of male interconnecting features, and a plurality of female interconnecting features. The body includes a front surface and a rear surface and a plurality of edges positioned therebetween. The front surface or the rear surface is configured to retain an antenna. The male interconnecting features of a first base connect with the female interconnecting features of a second base when the first base is joined with the second base to form the substrate or a portion of the substrate.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: August 15, 2023
    Assignee: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
    Inventors: Nicholas J. Furman, Kyle Byers, Daniel Salzman
  • Publication number: 20230046006
    Abstract: A base configured to be joined with other bases to form a substrate for an antenna array comprises a body, a plurality of male interconnecting features, and a plurality of female interconnecting features. The body includes a front surface and a rear surface and a plurality of edges positioned therebetween. The front surface or the rear surface is configured to retain an antenna. The male interconnecting features of a first base connect with the female interconnecting features of a second base when the first base is joined with the second base to form the substrate or a portion of the substrate.
    Type: Application
    Filed: August 11, 2021
    Publication date: February 16, 2023
    Applicant: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Nicholas J. Furman, Kyle Byers, Daniel Salzman