Abstract: Polymer (preferably polyimide) sheets with laser ablated through-holes plated with metal are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4-4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).

Abstract: The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).

Abstract: Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical conections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phylenediamine, preferably p-phenylenediamine).

Abstract: Article and method of making same by laser-ablation-machining of (a) aromatic and/or amorphous polyamide material, or (b) polymeric material having repeating in its polymer backbone aromatic rings and aliphatic chains (with the proviso that the aliphatic chains have at least 4 carbon atoms when the material is a polyester, and preferably in all cases U.V. laser radiation is preferred, preferably at wavelengths greater than 248 nm from a KrF or XeCl excimer laser. The preferred polyamides, polyetheresters, and polyimides have superior machining performance and may be useful for making uniaxially electrically conductive articles by machining holes cleanly through laminar sheets of the preferred polymers, which sheets are subsequently metal plated.

Abstract: Uniaxially conductive connector formed in situ on microchip by laser drilling an insulating layer at least 5 micrometers thick to provide holes communicating with the chip bonding sites, and depositing metal in the holes to establish electrical connection with the bonding sites. Excimer U.V. laser ablation of a polyimide insulating layer is preferred, followed by removal of a surface layer (preferably of amorphous polyamide from the insulating layer to expose the ends of the metal deposited in the holes.

Abstract: Apparatus for excimer laser image protection ablation of a target material comprising a projection lens system for projecting a mask pattern to be ablated onto the target, which lens system is telecentric towards the image (target) end of the projection path, and means for moving the target along the projection path whereby in use the size of the projected image areas to be ablated from the target is adjusted substantially without altering their relative portions of the target.

Abstract: An article of manufacture, for example a conductor for an electrical wire or cable, is provided with a refractory coating preferably formed from a refractory metal or semi-metal oxide or nitride and preferably deposited on the surface of the article by a vacuum deposition process such as a sputter ion plating method. Adhesion of the refractory coating, especially at high temperatures may be improved, and migration of the substrate metal through the coating may be suppressed by varying the stoichiometry of the coating through its thickness and/or by the provision of a metallic or refractory intermediate layer. The articles are particularly suitable for use in circuit and signal integrity cables.The vacuum deposited refractory layer may constitute the sole refractory, or additional refractory layers may be deposited by other methods e.g. a sol-gel method.

Abstract: A sheet laminate of polyimide and amorphous polyamide especially suitable for making anisotropically electrically conductive articles by laser abiation drilling followed by metal plating. Preferred polyimides include those derived from polymerization of 4,4'biphenyldianhydride and 4,4'-diaminobiphenylether or p-phenylenediamine. Preferred amorphous polyamides include those derived from condensation of terephthalic acid with isomers of trimethylhexamethylenediamine.

Abstract: An article of manufacture, for example a conductor for an electrical wire or cable, is provided with a refractory coating preferably formed from a refractory metal or semi-metal oxide or nitride and preferably deposited on the surface of the article by a vacuum deposition process such as a sputter ion plating method. Adhesion of the refractory coating, especially at high temperatures may be improved, and migration of the substrate metal through the coating may be suppressed by varying the stoichiometry of the coating through its thickness and/or by the provision of a metallic or refractory intermediate layer. The articles are particularly suitable for use in circuit and signal integrity cables.The vacuum deposited refractory layer may constitute the sole refractory, or additional refractory layers may be deposited by other methods e.g. a sol-gel method.