Patents by Inventor Nicholas J. Meeker

Nicholas J. Meeker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structures for Forming Printed Board Interconnects Using Solder
    Publication number: 20240172372
    Abstract: Certain exemplary embodiments can provide structures used to form printed board layer-to-layer interconnects using solder. When the structures are laminated together, forming a printed board, the solders fuse or bond to other electrically conductive materials forming layer-to-layer interconnects. Benefits include reduced fabrication time and costs, fewer and simpler process steps, known metallurgy, increased reliability, and a significant reduction in environmental impact.
    Type: Application
    Filed: June 19, 2023
    Publication date: May 23, 2024
    Applicant: Conductor Analysis Technologies, Inc.
    Inventors: Timothy A. Estes, Lance A. Auer, Nicholas J. Meeker