Abstract: A method for dicing a semiconductor wafer, including: cutting a reference slot in a back main surface of the wafer; cutting a back slot in the back main surface, the back slot positioned with respect to the reference slot; determining a desired location for a chip edge with respect to the reference slot; and applying radiant energy in a path such that a series of reformed regions are formed within the wafer along the path. A crystalline structure of the wafer is modified in the series of reformed regions and an alignment of an edge of the laser is with respect to the desired location for the chip edge and in alignment with the back slot. The method includes separating the wafer along the series of reformed regions to divide portions of the wafer on either side of the series of reformed regions.

Abstract: A method for dicing a semiconductor wafer, including: cutting a reference slot in a back main surface of the wafer; cutting a back slot in the back main surface, the back slot positioned with respect to the reference slot; determining a desired location for a chip edge with respect to the reference slot; and applying radiant energy in a path such that a series of reformed regions are formed within the wafer along the path. A crystalline structure of the wafer is modified in the series of reformed regions and an alignment of an edge of the laser is with respect to the desired location for the chip edge and in alignment with the back slot. The method includes separating the wafer along the series of reformed regions to divide portions of the wafer on either side of the series of reformed regions.

Abstract: The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.

Abstract: The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.

Abstract: A method for dicing small devices including MEMS, ink jet printheads, lasers etc. The method comprises making a first pass cut into a substrate with a blade of narrow kerf and having long wear characteristics. This first pass cut is then followed with a polishing blade of wider kerf having desirable smooth cutting qualities.