Patents by Inventor Nicholas J. Spiliotis

Nicholas J. Spiliotis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sulfate-free method of etching copper pattern on printed circuit boards
    Patent number: 4175011
    Abstract: In printed circuit board manufacture, a copper pattern on the board is slightly etched and then a tin/lead layer is plated onto the etched copper pattern. The etching step is free of sulfate materials and includes etching the copper pattern with an aqueous solution of hydrogen peroxide and fluoboric acid.
    Type: Grant
    Filed: July 17, 1978
    Date of Patent: November 20, 1979
    Assignee: Allied Chemical Corporation
    Inventor: Nicholas J. Spiliotis
  • Plating method with lead or tin sublayer
    Patent number: 4082621
    Abstract: A nickel or cobalt layer is electroplated from a fluoborate bath directly onto a lead or lead alloy or tin or tin alloy sublayer, which has been electroplated onto a metal surface. Microcracked chrome is electroplated over the nickel or cobalt layer. With a nonconductive plastic substrate, the sublayer is electroplated onto a metal film which was deposited on the plastic by an electroless method. The plated product includes a sublayer of about 0.05 to 2 mils lead or lead alloy or tin or tin alloy, a second layer of about 0.05 to 2 mils nickel or cobalt, and an outer layer of about 0.001 to 1 mil chrome.
    Type: Grant
    Filed: January 3, 1977
    Date of Patent: April 4, 1978
    Assignee: Allied Chemical Corporation
    Inventors: Nicholas J. Spiliotis, William R. Schevey, Donald W. Himler