Patents by Inventor Nicholas James Harold McKubre

Nicholas James Harold McKubre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit components with dummy structures
    Patent number: 11784121
    Abstract: Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: October 10, 2023
    Assignee: Intel Corporation
    Inventors: Kevin L. Lin, Nicholas James Harold McKubre, Richard Farrington Vreeland, Sansaptak Dasgupta
  • INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES
    Publication number: 20220216149
    Abstract: Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
    Type: Application
    Filed: March 21, 2022
    Publication date: July 7, 2022
    Applicant: Intel Corporation
    Inventors: Kevin L. Lin, Nicholas James Harold McKubre, Richard Farrington Vreeland, Sansaptak Dasgupta
  • Integrated circuit components with dummy structures
    Patent number: 11328992
    Abstract: Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: May 10, 2022
    Assignee: Intel Corporation
    Inventors: Kevin L. Lin, Nicholas James Harold McKubre, Richard Farrington Vreeland, Sansaptak Dasgupta
  • INTEGRATED CIRCUIT COMPONENTS WITH DUMMY STRUCTURES
    Publication number: 20200350246
    Abstract: Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
    Type: Application
    Filed: September 27, 2017
    Publication date: November 5, 2020
    Applicant: Intel Corporation
    Inventors: Kevin L. Lin, Nicholas James Harold McKubre, Richard Farrington Vreeland, Sansaptak Dasgupta
  • INDUCTOR/CORE ASSEMBLIES FOR INTEGRATED CIRCUITS
    Publication number: 20200152855
    Abstract: Disclosed herein are inductor/core assemblies for integrated circuits (ICs), as well as related structures, methods, and devices. In some embodiments, an IC structure may include an inductor and a magnetic core in an interior of the inductor. The magnetic core may be movable perpendicular to a plane of the inductor.
    Type: Application
    Filed: September 20, 2017
    Publication date: May 14, 2020
    Applicant: Intel Corporation
    Inventors: Kevin L. Lin, Nicholas James Harold McKubre, Han Wui Then