Patents by Inventor Nicholas Joy
Nicholas Joy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230197505Abstract: A method for patterning a substrate includes: forming a first photoresist etch mask with an extreme ultraviolet (EUV) lithography process, the first photoresist etch mask including first through openings, the first photoresist etch mask including a metal-based photoresist material; forming a second photoresist etch mask over the first photoresist etch mask, the second photoresist etch mask including second through openings; and forming first openings, through the first and the second photoresist etch masks, in a region of the substrate that vertically overlaps both the first through openings and the second through openings.Type: ApplicationFiled: December 17, 2021Publication date: June 22, 2023Inventors: Katie Lutker-Lee, Angelique Raley, Nicholas Joy
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Patent number: 11621190Abstract: A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, and pre-treating the substrate with a surface modifier that increases metal deposition selectivity on the second layer relative to on the first layer, depositing a metal layer on the substrate by vapor phase deposition, where the metal layer is preferentially deposited on the second layer in the recessed feature, and removing metal nuclei deposited on the first layer, including on a field area and on sidewalls of the first layer in the recessed feature, to selectively form the metal layer on the second layer in the recessed feature. The steps of pre-treating, depositing and removing may be repeated at least once to increase a thickness of the metal layer in the recessed feature.Type: GrantFiled: May 28, 2021Date of Patent: April 4, 2023Assignee: Tokyo Electron LimitedInventors: Kai-Hung Yu, David O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert Clark, Kandabara Tapily, Takahiro Hakamata, Cory Wajda, Gerrit Leusink
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Patent number: 11450562Abstract: A method of metallization includes receiving a substrate having a recess formed therein. The recess has a bottom and sidewalls, and a conformal liner is deposited on the bottom and sidewalls of the recess. The conformal liner is removed from an upper portion of the recess to expose upper sidewalls of the recess while leaving the conformal liner in a lower portion of the recess covering the bottom and lower sidewalls of the recess. Metal is deposited in a lower portion of the recess to form a metallization feature including the conformal liner in the lower portion of the recess and the metal.Type: GrantFiled: September 15, 2020Date of Patent: September 20, 2022Assignee: Tokyo Electron LimitedInventors: Kai-Hung Yu, Jodi Grzeskowiak, Nicholas Joy, Jeffrey Smith
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Patent number: 11322364Abstract: In accordance with an embodiment, a method of plasma processing includes etching a refractory metal by flowing oxygen into a plasma processing chamber, intermittently flowing a passivation gas into the plasma processing chamber, and supplying power to sustain a plasma in the plasma processing chamber.Type: GrantFiled: May 8, 2020Date of Patent: May 3, 2022Assignee: Tokyo Electron LimitedInventors: Nicholas Joy, Angelique Raley
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Publication number: 20210313192Abstract: In accordance with an embodiment, a method of plasma processing includes etching a refractory metal by flowing oxygen into a plasma processing chamber, intermittently flowing a passivation gas into the plasma processing chamber, and supplying power to sustain a plasma in the plasma processing chamber.Type: ApplicationFiled: May 8, 2020Publication date: October 7, 2021Inventors: Nicholas Joy, Angelique Raley
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Patent number: 11133194Abstract: A method of etching a substrate includes generating plasma comprising a first concentration of an etchant and a second concentration of an inhibitor and etching the substrate by exposing an exposed interface between a first material and a second material to the plasma. The first material includes a lower reactivity to both the etchant and the inhibitor than the second material. The first concentration is less than the second concentration. Etching the substrate includes etching the first material and the second material at the exposed interface to form an etched indentation including an enriched region of the second material, forming a passivation layer at the enriched region using the inhibitor, and etching the first material at the etched indentation. The passivation layer reduces an etch rate of the second material to a reduced rate that is less than an etch rate of the first material.Type: GrantFiled: February 20, 2020Date of Patent: September 28, 2021Assignee: Tokyo Electron LimitedInventors: Sergey Voronin, Christopher Catano, Nicholas Joy, Alok Ranjan, Christopher Talone
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Publication number: 20210287936Abstract: A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, and pre-treating the substrate with a surface modifier that increases metal deposition selectivity on the second layer relative to on the first layer, depositing a metal layer on the substrate by vapor phase deposition, where the metal layer is preferentially deposited on the second layer in the recessed feature, and removing metal nuclei deposited on the first layer, including on a field area and on sidewalls of the first layer in the recessed feature, to selectively form the metal layer on the second layer in the recessed feature. The steps of pre-treating, depositing and removing may be repeated at least once to increase a thickness of the metal layer in the recessed feature.Type: ApplicationFiled: May 28, 2021Publication date: September 16, 2021Inventors: Kai-Hung Yu, David O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert Clark, Kandabara Tapily, Takahiro Hakamata, Cory Wajda, Gerrit Leusink
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Patent number: 11024535Abstract: A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, and pre-treating the substrate with a surface modifier that increases metal deposition selectivity on the second layer relative to on the first layer, depositing a metal layer on the substrate by vapor phase deposition, where the metal layer is preferentially deposited on the second layer in the recessed feature, and removing metal nuclei deposited on the first layer, including on a field area and on sidewalls of the first layer in the recessed feature, to selectively form the metal layer on the second layer in the recessed feature. The steps of pre-treating, depositing and removing may be repeated at least once to increase a thickness of the metal layer in the recessed feature.Type: GrantFiled: October 10, 2019Date of Patent: June 1, 2021Assignee: Tokyo Electron LimitedInventors: Kai-Hung Yu, David O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert Clark, Kandabara Tapily, Takahiro Hakamata, Cory Wajda, Gerrit Leusink
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Publication number: 20210118693Abstract: A method of plasma processing that includes maintaining a plasma processing chamber between 10° C. to 200° C., flowing oxygen and nitrogen into the plasma processing chamber, where a ratio of a flow rate of the nitrogen to a flow rate of oxygen is between about 1:5 and about 1:1, and etching a ruthenium/osmium layer by sustaining a plasma in the plasma processing chamber.Type: ApplicationFiled: October 21, 2019Publication date: April 22, 2021Inventors: Nicholas Joy, Devi Koty, Qingyun Yang, Nathan P. Marchack, Sebastian Ulrich Engelmann
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Publication number: 20210082750Abstract: A method of metallization includes receiving a substrate having a recess formed therein. The recess has a bottom and sidewalls, and a conformal liner is deposited on the bottom and sidewalls of the recess. The conformal liner is removed from an upper portion of the recess to expose upper sidewalls of the recess while leaving the conformal liner in a lower portion of the recess covering the bottom and lower sidewalls of the recess. Metal is deposited in a lower portion of the recess to form a metallization feature including the conformal liner in the lower portion of the recess and the metal.Type: ApplicationFiled: September 15, 2020Publication date: March 18, 2021Applicant: Tokyo Electron LimitedInventors: Kai-Hung YU, Jodi GRZESKOWIAK, Nicholas JOY, Jeffrey SMITH
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Patent number: 10903077Abstract: Embodiments are described herein that form silicon germanium nano-wires while reducing or eliminating erosion of nitride layers (e.g., masks and spacers) caused during selective etching of silicon with respect to silicon germanium during formation of silicon germanium nano-wires. oxide layers are used to protect nitride layers during formation of silicon germanium (SiGe) nano-wires. In particular, multilayer spacers including oxide/nitride/oxide layers are formed to protect the nitride layers during selective silicon etch processes that are used to form silicon germanium nano-wires, for example, for field effect transistors (FETs). The multilayer spacers allow for target levels of erosion to be achieved for the nitride layers.Type: GrantFiled: July 15, 2019Date of Patent: January 26, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yusuke Yoshida, Christopher Catano, Christopher Talone, Nicholas Joy, Sergey Voronin
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Patent number: 10861744Abstract: A method of processing materials on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform hosting a plurality of processing modules including one or more film-forming modules, one or more etching modules, and one or more transfer modules is provided. A workpiece having an upper planar surface is received into the common manufacturing platform. The method further includes conformally applying a thin film over the feature pattern using one of the film-forming modules, removing the thin film from upper surfaces of the feature pattern using one of the etching modules to leave behind the thin film in the recessed feature, and removing the fill material from the upper planar surface of the workpiece. The integrated sequence of processing steps is executed in a controlled environment within the common manufacturing platform and without leaving the controlled environment.Type: GrantFiled: March 18, 2019Date of Patent: December 8, 2020Assignee: Tokyo Electron LimitedInventors: Ying Trickett, Kai-Hung Yu, Nicholas Joy, Kaoru Maekawa, Robert Clark
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Publication number: 20200266070Abstract: A method of etching a substrate includes generating plasma comprising a first concentration of an etchant and a second concentration of an inhibitor and etching the substrate by exposing an exposed interface between a first material and a second material to the plasma. The first material includes a lower reactivity to both the etchant and the inhibitor than the second material. The first concentration is less than the second concentration. Etching the substrate includes etching the first material and the second material at the exposed interface to form an etched indentation including an enriched region of the second material, forming a passivation layer at the enriched region using the inhibitor, and etching the first material at the etched indentation. The passivation layer reduces an etch rate of the second material to a reduced rate that is less than an etch rate of the first material.Type: ApplicationFiled: February 20, 2020Publication date: August 20, 2020Inventors: Sergey Voronin, Christopher Catano, Nicholas Joy, Alok Ranjan, Christopher Talone
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Patent number: 10734278Abstract: A process is provided in which low-k layers are protected from etch damage by the use of a selectively formed protection layer which forms on the low-k layer. In one embodiment, the low-k layers may be low-k dielectric layers utilized in BEOL process steps. In one embodiment, the selectively formed protection layer may be formed by a selective deposition process which selectively forms layers on the low-k dielectric but not over the conductor layer. The selectively formed protection layer may then be utilized to protect the low-k layer from a plasma etch that is utilized to recess the conductor. In this manner, a conductor (for example metal) may be recessed in a low-k dielectric layer via a plasma etch process.Type: GrantFiled: June 10, 2019Date of Patent: August 4, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Hirokazu Aizawa, Karthikeyan Pillai, Nicholas Joy, Kandabara Tapily
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Patent number: 10700009Abstract: A method is provided for void-free Ru metal filling of features in a substrate. The method includes providing a substrate containing features, depositing a Ru metal layer in the features, removing the Ru metal layer from a field area around an opening of the features, and depositing additional Ru metal in the features, where the additional Ru metal is deposited in the features at a higher rate than on the field area. According to one embodiment, the additional Ru metal is deposited until the features are fully filled with Ru metal.Type: GrantFiled: October 1, 2018Date of Patent: June 30, 2020Assignee: Tokyo Electron LimitedInventors: Kai-Hung Yu, Nicholas Joy, Eric Chih Fang Liu, David L. O'Meara, David Rosenthal, Masanobu Igeta, Cory Wajda, Gerrit J. Leusink
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Publication number: 20200118871Abstract: A method for filling recessed features with a low-resistivity metal. The method includes providing a patterned substrate containing a recessed feature formed in a first layer and a second layer that is exposed in the recessed feature, and pre-treating the substrate with a surface modifier that increases metal deposition selectivity on the second layer relative to on the first layer, depositing a metal layer on the substrate by vapor phase deposition, where the metal layer is preferentially deposited on the second layer in the recessed feature, and removing metal nuclei deposited on the first layer, including on a field area and on sidewalls of the first layer in the recessed feature, to selectively form the metal layer on the second layer in the recessed feature. The steps of pre-treating, depositing and removing may be repeated at least once to increase a thickness of the metal layer in the recessed feature.Type: ApplicationFiled: October 10, 2019Publication date: April 16, 2020Inventors: Kai-Hung Yu, David O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert Clark, Kandabara Tapily, Takahiro Hakamata, Cory Wajda, Gerrit Leusink
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Patent number: 10580691Abstract: A substrate processing method is provided for metal filling of recessed features in a substrate. According to one embodiment, the method includes providing a substrate containing horizontally spaced nested and isolated recessed features, filling the nested and isolated recessed features with a blocking material, and performing in any order: a) sequentially first, removing the blocking material from the nested recessed features, and second, filling the nested recessed features with a first metal, and b) sequentially first, removing the blocking material from the isolated recessed features, and second, filling the isolated recessed features with a second metal that is different from the first metal. According to one embodiment, the first metal may include Ru metal and the second metal may include Cu metal. According to one embodiment, a microelectronic device containing metal filled recessed features is provided.Type: GrantFiled: June 6, 2018Date of Patent: March 3, 2020Assignee: Tokyo Electron LimitedInventors: Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Nicholas Joy, Gerrit J. Leusink, Kai-Hung Yu
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Publication number: 20200027736Abstract: Embodiments are described herein that form silicon germanium nano-wires while reducing or eliminating erosion of nitride layers (e.g., masks and spacers) caused during selective etching of silicon with respect to silicon germanium during formation of silicon germanium nano-wires. oxide layers are used to protect nitride layers during formation of silicon germanium (SiGe) nano-wires. In particular, multilayer spacers including oxide/nitride/oxide layers are formed to protect the nitride layers during selective silicon etch processes that are used to form silicon germanium nano-wires, for example, for field effect transistors (FETs). The multilayer spacers allow for target levels of erosion to be achieved for the nitride layers.Type: ApplicationFiled: July 15, 2019Publication date: January 23, 2020Inventors: Yusuke Yoshida, Christopher Catano, Christopher Talone, Nicholas Joy, Sergey Voronin
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Publication number: 20190385906Abstract: A process is provided in which low-k layers are protected from etch damage by the use of a selectively formed protection layer which forms on the low-k layer. In one embodiment, the low-k layers may be low-k dielectric layers utilized in BEOL process steps. In one embodiment, the selectively formed protection layer may be formed by a selective deposition process which selectively forms layers on the low-k dielectric but not over the conductor layer. The selectively formed protection layer may then be utilized to protect the low-k layer from a plasma etch that is utilized to recess the conductor. In this manner, a conductor (for example metal) may be recessed in a low-k dielectric layer via a plasma etch process.Type: ApplicationFiled: June 10, 2019Publication date: December 19, 2019Inventors: Hirokazu Aizawa, Karthikeyan Pillai, Nicholas Joy, Kandabara Tapily
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Publication number: 20190295887Abstract: A method of processing materials on a semiconductor workpiece using an integrated sequence of processing steps executed on a common manufacturing platform hosting a plurality of processing modules including one or more film-forming modules, one or more etching modules, and one or more transfer modules is provided. A workpiece having an upper planar surface is received into the common manufacturing platform. The method further includes conformally applying a thin film over the feature pattern using one of the film-forming modules, removing the thin film from upper surfaces of the feature pattern using one of the etching modules to leave behind the thin film in the recessed feature, and removing the fill material from the upper planar surface of the workpiece. The integrated sequence of processing steps is executed in a controlled environment within the common manufacturing platform and without leaving the controlled environment.Type: ApplicationFiled: March 18, 2019Publication date: September 26, 2019Inventors: Ying Trickett, Kai-Hung Yu, Nicholas Joy, Kaoru Maekawa, Robert Clark