Patents by Inventor Nicholas Ka Ming Yu

Nicholas Ka Ming Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9318405
    Abstract: A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer. The molding compound may eliminate sidewall chipping and cracking as well as reduce the need for back side lamination.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: April 19, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Jianwen Xu, Lizabeth Ann Keser, William Stone, Steve Joseph Bezuk, Nicholas Ka Ming Yu
  • Publication number: 20150318229
    Abstract: A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer.
    Type: Application
    Filed: May 1, 2015
    Publication date: November 5, 2015
    Inventors: Jianwen XU, Lizabeth Ann KESER, William STONE, Steve Joseph BEZUK, Nicholas Ka Ming YU
  • Patent number: 9135976
    Abstract: A probabilistic programming current is injected into a cluster of bi-stable probabilistic switching elements, the probabilistic programming current having parameters set to result in a less than unity probability of any given bi-stable switching element switching, and a resistance of the cluster of bi-stable switching elements is detected. The probabilistic programming current is injected and the resistance of the cluster state detected until a termination condition is met. Optionally the termination condition is detecting the resistance of the cluster of bi-stable switching elements at a value representing a multi-bit data.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: September 15, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Wenqing Wu, Kendrick Hoy Leong Yuen, Xiaochun Zhu, Seung Hyuk Kang, Matthew Michael Nowak, Jeffrey Alexander Levin, Robert P. Gilmore, Nicholas Ka Ming Yu
  • Publication number: 20140098602
    Abstract: A probabilistic programming current is injected into a cluster of bi-stable probabilistic switching elements, the probabilistic programming current having parameters set to result in a less than unity probability of any given bi-stable switching element switching, and a resistance of the cluster of bi-stable switching elements is detected. The probabilistic programming current is injected and the resistance of the cluster state detected until a termination condition is met. Optionally the termination condition is detecting the resistance of the cluster of bi-stable switching elements at a value representing a multi-bit data.
    Type: Application
    Filed: December 12, 2013
    Publication date: April 10, 2014
    Inventors: Wenqing Wu, Kendrick Hoy Leong Yuen, Xiaochun Zhu, Seung Hyuk Kang, Matthew Michael Nowak, Jeffrey Alexander Levin, Robert P. Gilmore, Nicholas Ka Ming Yu