Abstract: This disclosure relates to a flexible mounting support for a wafer scale integrated circuit system which is adapted not only to support the wafer for maximum cooling exposure but also to contain the necessary driver circuits for the transmission of signals and power between the wafer and the outside world. The mounting support is formed of a plurality of layers with apertures to receive the wafer, which layers are laminated together with certain of the layers being provided with various portions of the lead circuitry required for signal and power transmission between the wafer and the driver circuits and between the driver circuits and the outside world. In particular, this laminated layer mounting support is provided with a mounting layer of a very thin, flexible material and a slightly smaller aperture so that the wafer may be seated thereon and also make electrical contact as may be required for reverse biasing and the like.