Patents by Inventor Nicholas M. Kopec

Nicholas M. Kopec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ring removal from processing chamber
    Patent number: 11101115
    Abstract: A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 24, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Nicholas M. Kopec, Damon K. Cox, Andreas Schmid
  • RING REMOVAL FROM PROCESSING CHAMBER
    Publication number: 20200335312
    Abstract: A method and apparatus for replacing process kits that include edge rings and/or support rings in processing chambers. In one implementation, a process kit comprises a multi-segment edge ring. The multi-segment edge ring comprises a first segment, a second segment, and a first annular body. The first annular body comprises a first upper surface, a first lower surface opposite the first upper surface, a first inner surface and a first outer surface. The first segment and the second segment are connectable to form the first annular body. The first lower surface is operable to be positioned over a substrate support disposed within a processing chamber, and at least a portion of the inner surface, which is positioned between the first upper surface and the first lower surface has a diameter greater than a diameter of a substrate to be processed in the processing chamber.
    Type: Application
    Filed: March 19, 2020
    Publication date: October 22, 2020
    Inventors: Nicholas M. KOPEC, Damon K. COX, Andreas SCHMID
  • Mass damper for semiconductor wafer handling end effector
    Patent number: 8985935
    Abstract: A calibrated mass damper for use with end effectors for semiconductor wafer handling robots is described. The calibrated mass damper reduces vibrational response in an end effector carrying a semiconductor wafer without requiring modification of the end effector structure.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: March 24, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Mark K. Tan, Nicholas M. Kopec, Richard M. Blank
  • MASS DAMPER FOR SEMICONDUCTOR WAFER HANDLING END EFFECTOR
    Publication number: 20130213169
    Abstract: A calibrated mass damper for use with end effectors for semiconductor wafer handling robots is described. The calibrated mass damper reduces vibrational response in an end effector carrying a semiconductor wafer without requiring modification of the end effector structure.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 22, 2013
    Inventors: Mark K. Tan, Nicholas M. Kopec, Richard M. Blank