Abstract: A family of slurries are disclosed which are useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers. The slurries of the invention are comprised of a liquid carrier; a sulfur-bearing compounds capable of converting copper to copper sulfide; optionally, abrasive particles (polishing agent; optionally a chelating agent; optionally a buffering agent; optionally, a stopping compound; optionally, other additives; and optionally, a co-solvent.

Abstract: A family of slurries are disclosed which are useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers. The slurries of the invention are comprised of a liquid carrier; a sulfur-bearing compounds capable of converting copper to copper sulfide; optionally, abrasive particles (polishing agent; optionally a chelating agent; optionally a buffering agent; optionally, a stopping compound; optionally, other additives; and optionally, a co-solvent.

Abstract: Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or sub-micron dimensioned trenches or vias.

Abstract: A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and controlling high current density roughness, grain size and orientation of a zinc coating obtained from an acidic aqueous zinc salt. The process comprises adding a sulfonated condensation product of naphthalene and formaldehyde to the acidic aqueous zinc salt in an electrolytic cell and applying an electromotive force to the anode and cathode in the cell sufficient to produce a high current density on the cathode. The composition consists essentially of an acidic aqueous zinc salt aqueous in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

Abstract: A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and controlling high current density roughness, grain size and orientation of a zinc coating obtained from an acidic aqueous zinc salt. The process comprises adding a sulfonated condensation product of naphthalene and formaldehyde to the acidic aqueous zinc salt in an electrolytic cell and applying an electromotive force to the anode and cathode in the cell sufficient to produce a high current density on the cathode. The composition consists essentially of an acidic aqueous zinc salt aqueous in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

Abstract: A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and controlling high current density roughness, grain size and orientation of a zinc coating obtained from an acidic aqueous zinc salt. The process comprises adding a sulfonated condensation product of naphthalene and formaldehyde to the acidic aqueous zinc salt in an electrolytic cell and applying an electromotive force to the anode and cathode in the cell sufficient to produce a high current density on the cathode. The composition consists essentially of an acidic aqueous zinc salt aqueous in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

Abstract: A procedure for the generation of organosulfonic acids from solutions of corresponding metal organosulfonate compounds by electrowinning, electrolytically driven hydrolysis or chemically driven hydrolysis is described. Appropriate organosulfonate compounds include the water soluble salts of alkanesulfonic and aromatic sulfonic acids which incorporate metals from Group VIB, VIIB, VIIIB, IB, IIB or VA of the periodic table. The electrowinning and electrolytic techniques described can be applied in divided or undivided cells and can be operated in continuous fashion to provide the greatest efficiency. Hydrolysis based methods can employ either anodic oxidation or oxidation both of which function to oxidize the metal cation(s) present to hydrolytically unstable higher oxidation states.

Abstract: Nickel phosphorus alloys can be electroplated from an aqueous acidic solution containing nickel alkane sulfonate and phosphorus acid.

Abstract: Orthophosphite ions produced by oxidation of hypophosphite in an electroless nickel plating bath can be removed by precipitation with an alkali metal or alkaline earth metal cation such as calcium. In order to avoid the precipitation of calcium sulfate and the generation of large amounts of particulates in the bath, nickel sulfate can be replaced by a nickel salt of an alkylsulfonic acid or hypophosphorous acid, whose anion forms a soluble salt with an alkali metal or alkaline earth metal cation.

Abstract: A water-soluble composition of matter free of an added buffering agent, for electrolytically depositing a chromium oxide coating on a metal substrate is disclosed comprising a mixture of a complexing agent for a buffering agent such as a boron oxide complexing agent that might be introduced into the composition, a trivalent chromium compound, a weak chelating agent, an optional conductivity enhancing cation, an optional depolarizer, and an optional surfactant. A process is also described as well as a product obtained by the process.

Abstract: This invention relates to aqueous solutions containing Ni cation and hypophosphite anion which have a Ni cation concentration greater than 36 grams/liter. Such solutions have utility in electroless nickel plating baths and processes as make-up solutions and replenishing solutions. The increased concentration of Ni cation results from the addition of the nickel salt of an alkyl sulfonic acid to the solution.

Abstract: The inventors disclose a process for producing semi-bright to bright electrogalvanic coatings at high current densities, comprising electroplating a cathodic conductive substrate in a coating bath based on:a) a zinc sulfur-acid salt;b) a low molecular weight polyoxyalkylene glycol based on 2 to about 4 carbon atom alkylene oxides;c) an aromatic sulfonate; andd) a conductivity enhancing salt.The process includes maintaining the coating composition at a pH from about 2 to about 5 and the current density on the substrate at from about 1,000 to about 3,700 ASF. The zinc sulfur-acid salt includes zinc sulfate or a zinc organosulfonate, and the conductivity enhancing salt, a potassium salt. In one embodiment, the aromatic sulfonate comprises a condensation product of an aromatic sulfonate and formaldehyde. The inventors also describes coating bath compositions.

Abstract: A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and edge burn and controlling high current density roughness, grain size and orientation of a zinc coating obtained from a zinc sulfate aqueous acidic electrogalvanic coating bath. The composition comprises a high molecular weight polyoxyalkylene glycol grain refining agent in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

Abstract: An electrogalvanizing process and composition are disclosed for reducing high current density dendrite (HCD) formation and edge burn and controlling high current density roughness, grain size and orientation of a zinc coating obtained from a zinc halide aqueous acidic electrogalvanic coating bath. A low molecular weight polyoxyalkylene glycol homopolymer or copolymer based on 3 to about 4 carbon atom alkylene oxides as a grain refining agent in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

Abstract: Apparatus and methods for removing formate ions from electroless metal plating baths employing formaldehyde as a reducing agent and typically comprising polyvalent anions as metal chelant and/or counterion. The apparatus and methods employ anion filtration to separate polyvalent anions from monovalent formate ions and ion exchange units to remove metal and metal chelant species from formate-containing streams. Preferred aspects of this invention provide apparatus and methods for removing formate from electroless copper plating baths.

Abstract: Phosphorus-containing, crystalline, nickel-coated fabric, wherein said nickel contains 1 to 6 weight percent phosphorus, has crystallites greater than 3 nanometers and has a surface resistivity of less than 1 ohm/square is deposited onto a substrate a surface which is catalytic to electroless deposition of nickel by immersing the substrate into an electroless nickel plating solution consisting essentially of nickel salt, one or more organic acids, hypophosphite reducing agent, thiourea and ammonia and essentially no heavy metal, wherein the concentration of said thiourea is less than 1 ppm, maintained at a pH of 6.5 to 8.5 and a temperature less than 60.degree. C. Preferred plating solutions comprise essentially no lead or cadmium and have a molar ratio of nickel to hypophosphite in said solution is 0.4 to 0.55. Preferred organic acids are selected from the group consisting of lactic acid, acetic acid, propionic acid, pyruvic acid, aspartic acid and glycolic acid.

Abstract: Sulfate-free electroless copper baths comprising cupric ions, formaldehyde, formate ions, hydroxyl ions, a copper counterion, e g. preferably a monovalent anion such as acetate, nitrate or formate, and copper chelant such as an alkali metal salt of aminotris(methylenephosphonic acid), biscarboxymethylaspartic acid, ethylenediaminetetra(methylenephosphonic acid), diethylenetriaminepenta(methylenephosphonic acid), gluconic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, mucic acid, D-saccharac acid, tartaric acid and N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine are amenable to the recovery of copper, e.g. from purge streams, using the methods and apparatus including solvent extraction, e.g. employing hydroxamic acid extractants, anion filtration, ion-exchange and chelant precipitation.

Abstract: Apparatus and methods for removing polyvalent by-product anions, e.g. borate and orthophosphate ions, from electroless metal plating baths employing borane or hypophosphite reducing agents and typically comprising monovalent anions or neutral zwitterions as metal chelant and/or counterion. The apparatus and methods of this invention employ (a) solvent extraction to remove metal species for recycle, (b) anion filtration to separate polyvalent anions from neutral zwitterions and monovalent anions and (c) ion exchange units to remove metal and metal chelant species from polyvalent anion-containing waste streams.

Abstract: Aqueous electroless nickel plating solutions comprising a water soluble nickel salt associated with a neutral zwitterion, e.g. alanine or glycine, and/or monovalent anion, e.g. lactate, nitrate, hypophosphite, acetate, sulfamate, hydrochloride, formate, propionate, trichloroacetate, trifluoroacetate, methanesulfonate, glycolate, aspartate or pyruvate, as counterion and chelant, a neutral, e.g. borate, or monovalent, e.g. hypophosphite, reducing agent, and a non-thiourea stabilizer, e.g. protonated dimethylamine or dimethylaminopropylamine or 2-hydroxyethanesulfonic acid. Valuable components of spent baths, e.g. nickel and neutral or monovalent anion species, can be advantageously recycled by employing solvent extraction and anion filtration operations.

Abstract: Novel chromium plating baths suitable for electrodepositing chromium layers which are bright, adherent, smooth and hard, and are capable of being formed at both high and low current densities, and at high cathodic current efficiencies, consist essentially of chromic acid and sulfoacetic acid in a concentration range of about 40 to 150 g/l., and selenate or tellurate ion. Sulfate ion, if present, is included in low concentrations such that the Cr/SO.sub.4 ratio is high, preferably 300:1 or more.