Abstract: Compositions containing unsaturated fatty esters may be stabilized against atmospheric oxidation by the addition of an antioxidant package containing a phenolic oxidant and a nonphenolic oxygen scavenger, which may be a hydroxylamine, an amine N-oxide, an oxime, or a nitrone. If an amine N-oxide is used, it may be used with or without a phenolic antioxidant. Compositions treated in this manner show good resistance to atmospheric oxidation and resultant viscosity increase.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: Compositions containing unsaturated fatty esters may be stabilized against atmospheric oxidation by the addition of an antioxidant package containing a phenolic oxidant and a nonphenolic oxygen scavenger, which may be a hydroxylamine, an amine N-oxide, an oxime, or a nitrone. If an amine N-oxide is used, it may be used with or without a phenolic antioxidant. Compositions treated in this manner show good resistance to atmospheric oxidation and resultant viscosity increase.

Abstract: Disclosed are aqueous solutions for use in high energy, highly efficient electrical energy storage devices. The solutions contain (a) a high purity sulfonic acid with a low concentration of low valent sulfur compounds or higher valent sulfur compounds susceptible to reduction, (b) a metal or metals in an oxidized state that are capable of being reduced to the zero valent oxidation state, (c) a metal that is in an oxidized state that is incapable of being reduced to its metallic state and (d) optionally, a buffering agent and/or conductivity salts.

Abstract: The invention relates to isoascorbate anti-skinning agents and also relates to oxidatively drying paints or coating compositions containing isoascorbate material which acts as both an antiskinning agent and a metals dryer co-promoter.

Abstract: The invention relates to a coating material, paint or finish which contains as anti-skinning agents a combination of at least one organic and/or inorganic oxygen scavengers and a nitrogen-containing aromatic compound and also relates to compositions containing the combination, especially oxidatively drying paints or coating compositions and articles coated with such oxidatively drying paints or coating compositions.

Abstract: The invention relates to a coating material, paint or finish which contains as anti-skinning agents a combination of at least two organic and/or inorganic oxygen scavengers and also relates to compositions containing the combination, especially oxidatively drying paints or coating compositions and articles coated with such oxidatively drying paints or coating compositions.

Abstract: Disclosed is a solution for an electrochemical process, the solution containing a sulfonic acid and having a low concentration of sulfur compounds, either low or high valence, that are susceptible to reduction and which is intended for use in electrodeposition, batteries, conductive polymers and descaling processes.

Abstract: The invention relates to anti-skinning agents containing combinations of (a) organic or inorganic oxygen scavengers with (b) alkylamines and/or alkyl alkanolamines and also relates to compositions containing the combination, especially oxidatively drying paints or coating compositions and articles coated with such oxidatively drying paints or coating compositions.

Abstract: The invention relates to anti-skinning agents containing mixtures of organic compounds (combinations of additives), whereby the organic compounds are selected from the groups of (a) organic hydroxylamines and (b) alkylamines and/or alkyl alkanolamines and also relates to compositions containing the combination, especially oxidatively drying paints or coating compositions and article coated with such oxidatively drying paints or coating compositions.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to about 2.50 M, and which are intended for the metallization of micron-sized dimensioned trenches or vias, through-holes and microvias.