Abstract: In order to achieve electromagnetic and/or thermal isolation between components in close proximity to each other on a common module substrate, an alternate package and method for manufacturing the package is provided. Inventive methods utilize a grounded, metal-coated overmold for a IC module package that can provide an alternate thermal path to heat sink high power components generating excess heat energy and/or provide general electromagnetic shielding and isolation between two integrated circuits in very close proximity that are susceptible to electromagnetic interference. A dielectric layer conformably covers semiconductor dies mounted on a substrate. On some semiconductor dies, a portion of the dielectric layer is removed from the back surface of the semiconductor dies to allow direct contact between the exposed back surface of the dies and a metallization layer forming part of the overmold. This direct contact allows heat energy to be drawn away from the dies.

Abstract: A system is provided wherein spectrometer measurements, and/or measurements from other analytical instruments, are transmitted to a processing station which determines the component substances of the sample(s) subjected to the measurements. The names of the component substances are then inserted into database search queries related to matters such as handling precautions, causes/sources of the substances, remedies and neutralizing agents for the substances, regulations related to the substances, etc. The results of the search queries are then provided to the personnel who made the measurements, preferably wirelessly and almost immediately after the measurements were made. The system therefore provides nearly immediate guidance as to what substances are present and how to handle them, which can be useful for inexperienced personnel in hazardous response, contraband detection, industrial process control, and other situations.

Abstract: In order to achieve electromagnetic and/or thermal isolation between components in close proximity to each other on a common module substrate, an alternate package and method for manufacturing the package is provided. Inventive methods utilize a grounded, metal-coated overmold for a IC module package that can provide an alternate thermal path to heat sink high power components generating excess heat energy and/or provide general electromagnetic shielding and isolation between two integrated circuits in very close proximity that are susceptible to electromagnetic interference. A dielectric layer conformably covers semiconductor dies mounted on a substrate. On some semiconductor dies, a portion of the dielectric layer is removed from the back surface of the semiconductor dies to allow direct contact between the exposed back surface of the dies and a metallization layer forming part of the overmold. This direct contact allows heat energy to be drawn away from the dies.