Patents by Inventor Nicholas Palcheck

Nicholas Palcheck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240208800
    Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 27, 2024
    Inventors: Ken Deng, Bing Yu, Michael Pedersen, Nicholas Palcheck, Jeremy Johnson, Richard Li-Chen Chen