Abstract: Approaches for checking a design of an integrated circuit using an antenna rule are provided. A method includes determining a figure of merit for a transistor based on a resistance of a shunt path of the transistor relative to the size of the antenna and the size of the transistor. The method also includes comparing the determined figure of merit to a limit. The method further includes deeming the transistor to pass the antenna rule when the figure of merit is less than the limit, and deeming the transistor to fail the antenna rule when the figure of merit is greater than the limit. The determining and the comparing are performed by a computer device.

Abstract: Approaches for checking a design of an integrated circuit using an antenna rule are provided. A method includes determining a figure of merit for a transistor based on a resistance of a shunt path of the transistor relative to the size of the antenna and the size of the transistor. The method also includes comparing the determined figure of merit to a limit. The method further includes deeming the transistor to pass the antenna rule when the figure of merit is less than the limit, and deeming the transistor to fail the antenna rule when the figure of merit is greater than the limit. The determining and the comparing are performed by a computer device.

Abstract: Approaches for checking a design of an integrated circuit using an antenna rule are provided. A method includes determining a figure of merit for a transistor based on a resistance of a shunt path of the transistor relative to the size of the antenna and the size of the transistor. The method also includes comparing the determined figure of merit to a limit. The method further includes deeming the transistor to pass the antenna rule when the figure of merit is less than the limit, and deeming the transistor to fail the antenna rule when the figure of merit is greater than the limit. The determining and the comparing are performed by a computer device.

Abstract: Approaches for checking a design of an integrated circuit using an antenna rule are provided. A method includes determining a figure of merit for a transistor based on a resistance of a shunt path of the transistor relative to the size of the antenna and the size of the transistor. The method also includes comparing the determined figure of merit to a limit. The method further includes deeming the transistor to pass the antenna rule when the figure of merit is less than the limit, and deeming the transistor to fail the antenna rule when the figure of merit is greater than the limit. The determining and the comparing are performed by a computer device.

Abstract: Approaches for checking a design of an integrated circuit using an antenna rule are provided. A method includes determining a figure of merit for a transistor based on a resistance of a shunt path of the transistor relative to the size of the antenna and the size of the transistor. The method also includes comparing the determined figure of merit to a limit. The method further includes deeming the transistor to pass the antenna rule when the figure of merit is less than the limit, and deeming the transistor to fail the antenna rule when the figure of merit is greater than the limit. The determining and the comparing are performed by a computer device.

Abstract: The present invention provides a compound of the following formula and salts thereof: Also provided is the use of these compounds as antibacterials, compositions comprising them and processes for their manufacture.

Abstract: The present invention provides a compound of the following formula and salts thereof: Also provided is the use of these compounds as antibacterials, compositions comprising them and processes for their manufacture.

Abstract: A turbine blade includes a hollow airfoil having a plurality of bowed tip holes extending through a tip floor thereof and skewed toward a squealer rib extending outwardly from the floor.

Abstract: A hollow turbine airfoil includes pressure and suction sidewalls extending in span between a root and tip and extending in chord between opposite leading and trailing edges. The pressure sidewall includes a first pattern of first holes distributed in span and chord over a majority thereof, and a second pattern of different second holes also distributed in span and chord over a minority of the pressure sidewall between the tip and the midspan of the airfoil.

Abstract: The invention provides compounds of the formula: wherein R1 is aryl, heteroaryl, cycloalkyl or alkyl; R2 is H, alkyl, nitro, C02R7, CONR5R6 or halo; R3 and R4 are H, NR5R6, NC(O)R7, halo, trifluromethyl, alkyl, CONR5R6, CO2R7, nitrile or alkoxy; R5 and R6 may be the same or different and may be H, alkyl, aryl, heteroaryl or cycloalkyl; or R5 and R6 may together form a saturated, unsaturated or partially saturated 4 to 7 member ring, wherein said ring may optionally comprise one or more further heteroatoms selected from N, O or S; R7 is H or alkyl; A is H, halo, or a group of formula X-L-Y; X is O, S or NR8; R8 is H or alkyl; L is (CH2)n, where n is 0, 1, 2, 3 or 4; and Y is aryl, a heterocyclic group, alkyl, alkenyl or cycloalkyl; the products of mono- and di-oxidation of sulphur and/or mono-oxidation of nitrogen moieties in compounds of formula I; or a pharmaceutically acceptable salt thereof.

Abstract: A turbine airfoil includes opposite pressure and suction sides extending in span from a flowpath surface. The flowpath surface has chordally opposite forward and aft edges and laterally opposite first and second endfaces corresponding with the airfoil pressure and suction sides. The flowpath surface joins the first endface at the forward edge in a forward bullnose and joins the second endface at the aft edge in an aft bullnose, with the bullnoses varying in radius from the opposite edges.

Abstract: A turbine blade includes an airfoil having pressure and suction sidewalls extending between leading and trailing edges and root and tip. The tip includes squealer ribs extending from a tip floor forming an open tip cavity. The rib along the pressure sidewall has a squared external corner, and a flute extends along the base of the rib at the tip floor.

Abstract: A compound of formula (I) wherein R1 is aryl, heteroaryl, cycloalkyl or alkyl; R2 is H, alkyl, nitro, —CO2R7, CONR4R5 or halo; R3 is H, NR4R5, NC(O)R8, halo, trifluoromethyl, alkyl, nitrile or alkoxy; R4 and R5 may be the same or different, and may be H, alkyl, aryl, heteroaryl or cycloalkyl; or R4 and R5 may together form a saturated, unsaturated or partially saturated 4 to 7 member ring, wherein said ring may optionally comprise one or more further heteroatoms selected from N, O or S; X is O, S or NR6; R6 is H or alkyl; R7 is hydrogen, methyl or ethyl; R8 is methyl or ethyl; L is (CH2)n, where n is 1, 2 or 3; and Y is aryl, a heterocyclic group, alkyl, alkenyl or cycloalkyl; together with pharmaceutically acceptable salts thereof. The use of these compounds as potassium channel inhibitors is also described.

Abstract: A heat sink having a base structure with a protruding thermal interface having an arcuate surface adapted to contact a processor assembly. The arcuate surface is adapted to accommodate a bent configuration of the base structure induced by a mounting load applied to the base structure.

Abstract: This invention relates to novel compound of formula (I) or pharmaceutically acceptable salts thereof. The invention is also directed to the uses of compounds having formula (I) in the treatment or prevention of diseases or disorders which requires potassium channel inhibition to an animal, mammal or human in need thereof. The invention is also directed to the use of compounds having formula (I) in the treatment or prevention of arrhythmia to an animal, mammal or human in need thereof.

Abstract: A method and apparatus that allows additional contact pads to be added to a package to support debug and test operations is disclosed. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package preferably includes a substrate having a matrix of conductive contact pads on both the top and bottom surfaces of the substrate. The interposer preferably includes a body having a matrix of interposer contact bumps on both the inner and outer surfaces of the body. Each interposer contact bump preferably includes a metal coating and is shaped to abut a contact pad of the semiconductor package.

Abstract: A method and apparatus that allows additional contact pads to be added to a package to support debug and test operations is disclosed. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package preferably includes a substrate having a matrix of conductive contact pads on both the top and bottom surfaces of the substrate. The interposer preferably includes a body having a matrix of interposer contact bumps on both the inner and outer surfaces of the body. Each interposer contact bump preferably includes a metal coating and is shaped to abut a contact pad of the semiconductor package.