Patents by Inventor Nicholas Philip Ludford

Nicholas Philip Ludford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11697174
    Abstract: A method of diffusion bonding metal or metal alloy containing workpieces, comprises (a) coating the bonding surfaces of the metal or metal alloy containing workpieces with a layer of a coating material, (b) abrading the coated bonding surfaces to remove surface oxide, the coating material being in liquid form, (c) removing excess coating material or excess abraded metal or metal alloy containing workpiece material from the coated bonding surfaces, and (d) diffusion bonding the coated bonding surfaces of the metal or metal alloy containing workpieces together. The coating material is operable to form a stable barrier on the bonding surfaces of the metal or metal alloy containing workpieces under ambient conditions, and evaporates from the bonding surfaces under diffusion bonding conditions. There is also a bonded workpiece formed using the method of diffusion bonding metal or metal alloy containing workpieces.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: July 11, 2023
    Inventors: Alec Gordon Gunner, Nicholas Philip Ludford
  • Publication number: 20210220943
    Abstract: A method of diffusion bonding metal or metal alloy containing workpieces, comprises (a) coating the bonding surfaces of the metal or metal alloy containing workpieces with a layer of a coating material, (b) abrading the coated bonding surfaces to remove surface oxide, the coating material being in liquid form, (c) removing excess coating material or excess abraded metal or metal alloy containing workpiece material from the coated bonding surfaces, and (d) diffusion bonding the coated bonding surfaces of the metal or metal alloy containing workpieces together. The coating material is operable to form a stable barrier on the bonding surfaces of the metal or metal alloy containing workpieces under ambient conditions, and evaporates from the bonding surfaces under diffusion bonding conditions. There is also a bonded workpiece formed using the method of diffusion bonding metal or metal alloy containing workpieces.
    Type: Application
    Filed: May 9, 2019
    Publication date: July 22, 2021
    Inventors: Alec Gordon Gunner, Nicholas Philip Ludford