Patents by Inventor Nicholas R. Mercurio

Nicholas R. Mercurio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INGOT AND METHODS FOR INGOT GRINDING
    Publication number: 20160096248
    Abstract: A method of grinding an ingot for use in manufacturing a semiconductor or solar wafer is disclosed. The method includes providing an ingot including four flat sides and four rounded corner portions, each corner portion extending between an adjacent pair of the flat sides, and grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape. A wafer and ingot are also disclosed.
    Type: Application
    Filed: December 11, 2015
    Publication date: April 7, 2016
    Inventors: James A. Hicks, Nicholas R. Mercurio
  • Systems and methods for ingot grinding
    Patent number: 9242333
    Abstract: A method of grinding an ingot for use in manufacturing a semiconductor or solar wafer is disclosed. The method includes providing an ingot including four flat sides and four rounded corner portions, each corner portion extending between an adjacent pair of the flat sides, and grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape. A wafer and ingot are also disclosed.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: January 26, 2016
    Assignee: MEMC Singapore Pte. Ltd.
    Inventors: James A. Hicks, Nicholas R. Mercurio
  • SYSTEMS AND METHODS FOR INGOT GRINDING
    Publication number: 20130295403
    Abstract: A method of grinding an ingot for use in manufacturing a semiconductor or solar wafer is disclosed. The method includes providing an ingot including four flat sides and four rounded corner portions, each corner portion extending between an adjacent pair of the flat sides, and grinding a plurality of planar facets on each corner portion, each planar facet of the corner portion joined to an adjacent facet at a juncture and oriented such that each corner portion has a substantially arcuate shape. A wafer and ingot are also disclosed.
    Type: Application
    Filed: May 2, 2013
    Publication date: November 7, 2013
    Applicant: MEMC Singapore Pte. Ltd.(UEN200614794D)
    Inventors: James A. Hicks, Nicholas R. Mercurio