Patents by Inventor Nicholas Randolph Watts

Nicholas Randolph Watts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with package to package connection
    Patent number: 7952182
    Abstract: A semiconductor package comprises a first package; a second package that is provided on the first package; and a first interconnect that comprises a bump to couple to the first package and a base material layer to cover the bump, wherein the second package is supported on the base material layer that is coupled to the bump.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: May 31, 2011
    Assignee: Intel Corporation
    Inventors: Nicholas Randolph Watts, Javier Soto Gonzalez
  • SEMICONDUCTOR DEVICE WITH PACKAGE TO PACKAGE CONNECTION
    Publication number: 20090321906
    Abstract: A semiconductor package comprises a first package; a second package that is provided on the first package; and a first interconnect that comprises a bump to couple to the first package and a base material layer to cover the bump, wherein the second package is supported on the base material layer that is coupled to the bump.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Nicholas Randolph Watts, Javier Soto