Abstract: A method includes receiving a first facial framework and a first captured image of a face. The first facial framework corresponds to the face at a first frame and includes a first facial mesh of facial information. The method also includes projecting the first captured image onto the first facial framework and determining a facial texture corresponding to the face based on the projected first captured image. The method also includes receiving a second facial framework at a second frame that includes a second facial mesh of facial information and updating the facial texture based on the received second facial framework. The method also includes displaying the updated facial texture as a three-dimensional avatar. The three-dimensional avatar corresponds to a virtual representation of the face.

Abstract: A method includes receiving a first facial framework and a first captured image of a face. The first facial framework corresponds to the face at a first frame and includes a first facial mesh of facial information. The method also includes projecting the first captured image onto the first facial framework and determining a facial texture corresponding to the face based on the projected first captured image. The method also includes receiving a second facial framework at a second frame that includes a second facial mesh of facial information and updating the facial texture based on the received second facial framework. The method also includes displaying the updated facial texture as a three-dimensional avatar. The three-dimensional avatar corresponds to a virtual representation of the face.

Abstract: A method includes receiving a first facial framework and a first captured image of a face. The first facial framework corresponds to the face at a first frame and includes a first facial mesh of facial information. The method also includes projecting the first captured image onto the first facial framework and determining a facial texture corresponding to the face based on the projected first captured image. The method also includes receiving a second facial framework at a second frame that includes a second facial mesh of facial information and updating the facial texture based on the received second facial framework. The method also includes displaying the updated facial texture as a three-dimensional avatar. The three-dimensional avatar corresponds to a virtual representation of the face.

Abstract: A method (300) includes receiving a first facial framework (144a) and a first captured image (130a) of a face (20). The first facial framework corresponds to the face at a first frame and includes a first facial mesh (142a) of facial information (140). The method also includes projecting the first captured image onto the first facial framework and determining a facial texture (212) corresponding to the face based on the projected first captured image. The method also includes receiving a second facial framework (144b) at a second frame that includes a second facial mesh (142b) of facial information and updating the facial texture based on the received second facial framework. The method also includes displaying the updated facial texture as a three-dimensional avatar (160). The three-dimensional avatar corresponds to a virtual representation of the face.

Abstract: A method (300) includes receiving a first facial framework (144a) and a first captured image (130a) of a face (20) The first facial framework corresponds to the face at a first frame and includes a first facial mesh (142a) of facial information (140). The method also includes projecting the first captured image onto the first facial framework and determining a facial texture (212) corresponding to the face based on the projected first captured image. The method also includes receiving a second facial framework (144b) at a second frame that includes a second facial mesh (142b) of facial information and updating the facial texture based on the received second facial framework. The method also includes displaying the updated facial texture as a three-dimensional avatar (160). The three-dimensional avatar corresponds to a virtual representation of the face.

Abstract: A process for coating a substrate heated to a temperature below the condensation temperature of a semiconductor material at atmospheric pressure is disclosed, the process including the steps of mixing a mass of semiconductor material and a heated inert gas stream, vaporizing the controlled mass of semiconductor material within the inert gas to generate a sub-saturated fluid mixture, directing the sub-saturated fluid mixture at the substrate, wherein the substrate is at substantially atmospheric pressure, depositing a layer of the semiconductor material onto a surface of the substrate, extracting undeposited semiconductor material, and repeating the steps of generating, directing, depositing, and extracting, to minimize an amount of undeposited semiconductor material.

Abstract: A process for coating a substrate at atmospheric pressure comprises the steps of vaporizing a controlled mass of semiconductor material at substantially atmospheric pressure within a heated inert gas stream, to create a fluid mixture having a temperature above the condensation temperature of the semiconductor material, directing the fluid mixture at substantially atmospheric pressure onto the substrate having a temperature below the condensation temperature of the semiconductor material, and depositing a layer of the semiconductor material onto a surface of the substrate.

Abstract: A process for coating a substrate at atmospheric pressure comprises the steps of vaporizing a controlled mass of semiconductor material at substantially atmospheric pressure within a heated inert gas stream, to create a fluid mixture having a temperature above the condensation temperature of the semiconductor material, directing the fluid mixture at substantially atmospheric pressure onto the substrate having a temperature below the condensation temperature of the semiconductor material, and depositing a layer of the semiconductor material onto a surface of the substrate.

Abstract: Apparatus (12, 12a) and a method for depositing a semiconductor material on a glass sheet substrate (G) utilizes a distributor (22) including a heated permeable member (24) through which a carrier gas and a semiconductor material are passed to provide a vapor that is deposited as a semiconductor layer on the conveyed glass sheet substrate. The permeable member (24) is tubular and has an electrical voltage applied along its length to provide the heating, and the carrier gas and the semiconductor as a powder are introduced into the tubular permeable member for flow outwardly therefrom as the vapor. A shroud (34) extending around the tubular permeable member (24) has an opening (36) through which the vapor flows for the semiconductor layer deposition.

Abstract: Apparatus (12, 12a) and a method for depositing a material on a substrate (G) utilizes a distributor (22) including a heated permeable member (24) through which a carrier gas and a material are passed to provide a vapor that is deposited on a conveyed substrate. The permeable member (24) is tubular and has an electrical voltage applied along its length to provide the heating, and the carrier gas and the material as a powder are introduced into the tubular permeable member for flow outwardly therefrom as the vapor. A shroud (34) extending around the tubular permeable member (24) has an opening (36) through which the vapor flows for the deposition. In one embodiment of apparatus (12), the vapor is deposited on an upwardly facing surface (56) of the substrate, while another embodiment of the apparatus (12a) deposits the vapor on a downwardly facing surface (54) of the substrate.