Patents by Inventor Nicholas Robert STOKES

Nicholas Robert STOKES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170186688
    Abstract: Metal filling processes for semiconductor devices and methods of fabricating semiconductor devices. One method includes, for instance: obtaining a wafer with at least one contact opening; depositing a metal alloy into at least a portion of the at least one contact opening; separating the metal alloy into a first metal layer and a second metal layer; depositing a barrier stack over the wafer; forming at least one trench opening; forming at least one via opening; and depositing at least one metal material into the trench openings and via openings. An intermediate semiconductor device is also disclosed.
    Type: Application
    Filed: March 16, 2017
    Publication date: June 29, 2017
    Applicant: GLOBALFOUNDRIES Inc.
    Inventors: Sunil Kumar SINGH, Ravi Prakash SRIVASTAVA, Nicholas Robert STOKES
  • Publication number: 20170047290
    Abstract: Metal filling processes for semiconductor devices and methods of fabricating semiconductor devices. One method includes, for instance: obtaining a wafer with at least one contact opening; depositing a metal alloy into at least a portion of the at least one contact opening; separating the metal alloy into a first metal layer and a second metal layer; depositing a barrier stack over the wafer; forming at least one trench opening; forming at least one via opening; and depositing at least one metal material into the trench openings and via openings. An intermediate semiconductor device is also disclosed.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 16, 2017
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Sunil Kumar SINGH, Ravi Prakash SRIVASTAVA, Nicholas Robert STOKES