Abstract: An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A bridge holds a transfer mechanism assembly and a die substrate holder configured to hold the first substrate. A controller is configured to cause the bridge and the transfer mechanism assembly and the die substrate holder to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

Abstract: An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. A needle is disposed adjacent a second side of the wafer tape opposite the first side. A length of the needle extends in a direction toward the wafer tape. A first needle actuator is used to adjust an angle of the needle to align the die, wafer tape, and transfer surface at which point the needle presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.

Abstract: A waterproof sealed circuit apparatus includes a circuit substrate having a first side opposite a second side. The first side includes a circuit trace. A semiconductor device die is electrically coupled to the circuit trace on the first side of the circuit substrate. A polymer sealing layer is adhered to the first side of the circuit substrate and covers the semiconductor device die. Polymer chains of the sealing layer are crosslinked.

Abstract: An automated system and method are provided for forming composite materials.