Patents by Inventor Nicholas Szabo

Nicholas Szabo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150293
    Abstract: Compounds of Formula (I): wherein R1, R3, R11, R12, X, Y1, Y2, Y3, Y4 and are as defined in the description. Medicinal products containing the same which are useful in treating conditions requiring anti-apoptotic inhibitors.
    Type: Application
    Filed: January 11, 2022
    Publication date: May 9, 2024
    Inventors: Stephen STOKES, Simon BEDFORD, l-Jen CHEN, James Edward Paul DAVIDSON, Nicholas DAVIES, Christopher John GRAHAM, Sean Martin MCKENNA, Johannes W.G. MEISSNER, James Brooke MURRAY, Rachel Jane PARSONS, Stuart RAY, Emma SANDERS, Claire Louise WALMSLEY, Paul Andrew BROUGH, András KOTSCHY, Ágnes PROSZENYÁK, Ádám SINAI, Balázs Károly BÁLINT, Márton CSÉKEI, Márton ZWILLINGER, Rita GARAMVÖLGYI, Szabolcs SIPOS, Vilibald KUN, Zoltán SZABÓ, Maïa CHANRION, Francesca ROCCHETTI, Frédéric COLLAND, Ana Leticia MARAGNO, Laura BRESSON
  • Patent number: 11974788
    Abstract: An orthopedic instrument, comprising a pair of pivotally-connected arms, extending beyond a pivot axis of a first pivot; a pair of feet mounted to ends of the pair of pivotally-connected arms; and a quadrilateral linkage configured to maintain parallelism between the pair of feet over a range of angles and to selectively alter a distance between the pair of feet.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: May 7, 2024
    Assignee: Ivytech Design LLC
    Inventors: Trevor Chan, Nicholas Szabo, Matthew Riedel, Brad Yoo, Steven Tommasini, Shelby Meckstroth, Per Kyle Almquist, Daniel Wiznia, Joshua Robert Vogel
  • Publication number: 20220361930
    Abstract: An orthopedic instrument, comprising a pair of pivotally-connected arms, extending beyond a pivot axis of a first pivot; a pair of feet mounted to ends of the pair of pivotally-connected arms; and a quadrilateral linkage configured to maintain parallelism between the pair of feet over a range of angles and to selectively alter a distance between the pair of feet.
    Type: Application
    Filed: November 16, 2021
    Publication date: November 17, 2022
    Inventors: Trevor Chan, Nicholas Szabo, Matthew Riedel, Brad Yoo, Steven Tommasini, Shelby Meckstroth, Per Kyle Almquist, Daniel Wiznia, Joshua Robert Vogel
  • Publication number: 20080304734
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: August 7, 2008
    Publication date: December 11, 2008
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Publication number: 20050254698
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: July 13, 2005
    Publication date: November 17, 2005
    Inventors: Scott Young, Roger Kroeze, Curt Chadwick, Nicholas Szabo, Kent Douglas, Fred Babian
  • Publication number: 20030063190
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: December 9, 2002
    Publication date: April 3, 2003
    Applicant: KLA INSTRUMENTS CORPORATION
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Publication number: 20020075385
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, the those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Application
    Filed: January 31, 2002
    Publication date: June 20, 2002
    Applicant: KLA INSTRUMENTS CORPORATION
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian
  • Patent number: 6141038
    Abstract: A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.
    Type: Grant
    Filed: June 27, 1997
    Date of Patent: October 31, 2000
    Assignee: KLA Instruments Corporation
    Inventors: Scott A. Young, Roger Kroeze, Curt H. Chadwick, Nicholas Szabo, Kent E. Douglas, Fred E. Babian