Patents by Inventor Nicholas T. Kamar

Nicholas T. Kamar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11655353
    Abstract: A sheet molding compound (SMC) is provided with superior conductivity properties based on the use of graphitics. A process for exfoliation of GnP and turbostratic carbon is also provided. By exfoliating the graphitics, a reduced amount of material can confer comparable properties relative to native GnPs or turbostratic carbon thereby reducing the amount of material usage, but also reducing negative effects to the base resin formulation through inclusion of these additives. Particular utility is found in thermoset resin molding to produce articles that are amenable to electrostatic coating and other surface treatments that rely on surface conductivity and especially in the realm of vehicle body parts.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 23, 2023
    Assignee: Teijin Automotive Technologies, Inc.
    Inventors: Nicholas T. Kamar, David J. Krug, Michael J. Siwajek
  • Publication number: 20220306857
    Abstract: A cured article includes a cured thermoset resin matrix defining an article surface. Hollow glass microspheroids are dispersed in the cured thermoset resin matrix. A low profile additive package is dispersed in the cured thermoset resin matrix. A plurality of carbon fiber bundles are present and wet by the cured thermoset resin matrix. The matrix formed from a prepolymer and styrenic monomer. A free radical initiator is provided to cure the thermoset resin matrix and having limited decomposition products with a boiling point of between 160-210° C.; wherein the article emits less than 250 parts per million (ppm) of volatiles as measured after heating to 185° C. at a rate of 14° C./min and held for 1 minute.
    Type: Application
    Filed: August 14, 2020
    Publication date: September 29, 2022
    Applicant: Teijin Automotive Technologies, Inc.
    Inventors: David J. Krug, III, Nicholas T. Kamar, Michael Z. Asuncion, Steven L. Prascius, MIchael J. Siwajek
  • Publication number: 20200165410
    Abstract: A sheet molding compound (SMC) is provided with superior conductivity properties based on the use of graphitics. A process for exfoliation of GnP and turbostratic carbon is also provided. By exfoliating the graphitics, a reduced amount of material can confer comparable properties relative to native GnPs or turbostratic carbon thereby reducing the amount of material usage, but also reducing negative effects to the base resin formulation through inclusion of these additives. Particular utility is found in thermoset resin molding to produce articles that are amenable to electrostatic coating and other surface treatments that rely on surface conductivity and especially in the realm of vehicle body parts.
    Type: Application
    Filed: January 31, 2020
    Publication date: May 28, 2020
    Applicant: Continental Structural Plastics, Inc.
    Inventors: Nicholas T. Kamar, David J. Krug, Michael J. Siwajek