Patents by Inventor Nicholas Torleiv Bronn

Nicholas Torleiv Bronn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210305165
    Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.
    Type: Application
    Filed: March 31, 2020
    Publication date: September 30, 2021
    Inventors: Dongbing Shao, Eric Peter Lewandowski, Nicholas Torleiv Bronn, Markus Brink
  • Patent number: 11102879
    Abstract: A transition between a printed circuit board and a dielectric layer with controlled impedance and reduced and/or mitigate crosstalk for quantum applications are provided. A quantum device can comprise a microwave quantum circuit on a dielectric substrate and a printed circuit board comprising a via that comprises a transmission line. A wirebond between the transmission line of the printed circuit board and a transmission line of the microwave quantum circuit operatively couples the microwave quantum circuit to the printed circuit board. The via comprises a defined characteristic impedance. The wirebond provides a microwave signal connection between the printed circuit board and the microwave quantum circuit.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: August 24, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas Torleiv Bronn
  • Publication number: 20210201187
    Abstract: Systems, computer-implemented methods, and computer program products that can facilitate determining a state of a qubit are described. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a relation determining component that can determine relation of a status signal of a quantum computing device to a noise value of the quantum computing device. The system can further include an operation time estimator that can estimate an operation time for the quantum computing device based on the relation of the status signal to the noise value.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 1, 2021
    Inventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
  • Publication number: 20210076530
    Abstract: Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 11, 2021
    Inventors: Sean Hart, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Patryk Gumann, Salvatore Bernardo Olivadese
  • Publication number: 20210068320
    Abstract: Techniques regarding shielding one or more superconducting devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a multi-layer enclosure that shields a superconducting device from a magnetic field and radiation. Further, the multi-layer enclosure can comprise a superconducting material layer that can have a thickness that inhibits a penetration of the multi-layer enclosure by the magnetic field. The multi-layer enclosure can also comprise a metal layer adjacent to the superconducting material layer. The metal layer can have a high thermal conductivity that achieves thermalization with the superconducting material layer. Moreover, the multi-layer enclosure can comprise a radiation shield layer adjacent to the superconducting material layer.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Daniela Florentina Bogorin, Sean Hart, Patryk Gumann, Nicholas Torleiv Bronn, Salvatore Bernardo Olivadese, Oblesh Jinka
  • Publication number: 20210003457
    Abstract: Techniques regarding determining the temperature of one or more quantum computing devices are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a temperature component that can determine a temperature of a superconducting resonator based on a frequency shift exhibited by the superconducting resonator due to a change in kinetic inductance with a change in temperature.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 7, 2021
    Inventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
  • Publication number: 20210003456
    Abstract: Techniques regarding determining and/or analyzing temperature distributions experienced by quantum computer devices during operation are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can also comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise a region component that can define a plurality of temperature regions from a quantum computing device layout. The computer executable component can also comprise a map component that can generate a map that characterizes a temperature distribution by determining at least one temperature achieved within the plurality of temperature regions during an operation of the quantum computing device layout.
    Type: Application
    Filed: July 2, 2019
    Publication date: January 7, 2021
    Inventors: Salvatore Bernardo Olivadese, Daniela Florentina Bogorin, Nicholas Torleiv Bronn, Sean Hart, Patryk Gumann
  • Publication number: 20200404806
    Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 24, 2020
    Applicant: International Business Machines Corporation
    Inventors: Oblesh Jinka, Salvatore Bernardo Olivadese, Sean Hart, Nicholas Torleiv Bronn, Jerry M. Chow, Markus Brink, Patryk Gumann, Daniela Florentina Bogorin
  • Publication number: 20200259064
    Abstract: In an embodiment, a quantum device includes a first set of protrusions formed on a substrate and a second set of protrusions formed on a qubit chip. In the embodiment, the quantum device includes a set of bumps formed on an interposer, the set of bumps formed of a material having above a threshold ductility at a room temperature range, wherein a first subset of the set of bumps is configured to cold weld to the first set of protrusions and a second subset of the set of bumps is configured to cold weld to the second set of protrusions.
    Type: Application
    Filed: February 11, 2019
    Publication date: August 13, 2020
    Applicant: International Business Machines Corporation
    Inventors: Eric Peter Lewandowski, Jae-Woong Nah, Nicholas Torleiv Bronn
  • Publication number: 20200250565
    Abstract: Protecting qubits of a quantum processor from spontaneous emission and thermal photon noise includes connecting a first port of a filter to a signal line of a readout resonator of a qubit circuit of a quantum processor. The filter has a passband including a readout resonator frequency associated with the readout resonator and a first stopband including a qubit transition frequency associated with the qubit circuit. A second port of the filter is connected to a measurement device. a signal line of the filter is galvanically connected to a reference ground in thermal contact to a stage of a cryostat. The galvanic connection further makes a thermal connection to an input signal line of the qubit circuit.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 6, 2020
    Applicant: International Business Machines Corporation
    Inventors: Nicholas Torleiv Bronn, Patryk Gumann
  • Patent number: 10681842
    Abstract: Devices, systems, methods, and computer-implemented methods to facilitate transmitting microwave signals to one or more cryogenic stages of a cryogenic refrigerator are provided. According to an embodiment, a device can comprise a monolithic signal carrier device comprising a thermal barrier disposed within a ground layer and a signal layer. The device can further comprise a thermal decoupling device coupled at the thermal barrier to the ground layer and the signal layer.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sean Hart, Nicholas Torleiv Bronn, Patryk Gumann, Salvatore Bernardo Olivadese
  • Publication number: 20200100357
    Abstract: A transition between a printed circuit board and a dielectric layer with controlled impedance and reduced and/or mitigate crosstalk for quantum applications are provided. A quantum device can comprise a microwave quantum circuit on a dielectric substrate and a printed circuit board comprising a via that comprises a transmission line. A wirebond between the transmission line of the printed circuit board and a transmission line of the microwave quantum circuit operatively couples the microwave quantum circuit to the printed circuit board. The via comprises a defined characteristic impedance. The wirebond provides a microwave signal connection between the printed circuit board and the microwave quantum circuit.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 26, 2020
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Nicholas Torleiv Bronn