Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Provided herein are systems and methods for magnetically gripping an object. A magnetic gripping system may comprise a gripper having different, tunable gripping states that are associated with different magnetic field strengths.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

Abstract: Systems and methods are provided for an electroactuated adhesion system containing a dry adhesive material and at least two patterned electrodes. The two or more patterned electrodes may be capable of promoting or increasing adhesion of the electroactuated adhesion system while simultaneously preventing or mitigating the accumulation of dust, contaminants, or particulates on the surface of the adhesive material.

Abstract: Provided are systems, devices, and methods for sensing location and forces. A robotic effector comprising a skin and a core can have a plurality of electrodes integrated in the skin and/or core. Upon interaction with a target object, the robotic effector may determine a total force and/or a location of the force by the target object on the robotic effector. Sensitivity and dynamic range of the robotic effector may improve by changing various configurations.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

Abstract: Provided are systems, devices, and methods for sensing location and forces. A robotic effector comprising a skin and a core can have a plurality of electrodes integrated in the skin and/or core. Upon interaction with a target object, the robotic effector may determine a total force and/or a location of the force by the target object on the robotic effector. Sensitivity and dynamic range of the robotic effector may improve by changing various configurations.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Abstract: Disclosed is a tactile sensing and integrated vision system that surmounts problems of existing systems. The tactile sensing skin can be formed into any shape, size, or form factor, including large areas. Computer-implemented algorithms can detect position-orientation and force-torque at landmark points for a given object set. The result is a modular sensing system that is highly scalable in terms of price, quantity, size and applications. Such skin technology and associated software can comprise a sensing package that integrates tactile and visual data with accompanying software for state estimation, situational awareness, and automatic control of machinery. The addition of tactile data can serve to constrain and/or augment visual pose estimation methods as well as provide pose estimation to visually occluded objects.

Abstract: Disclosed is a tactile sensing and integrated vision system that surmounts problems of existing systems. The tactile sensing skin can he formed into any shape, size, or form factor, including large areas. Computer-implemented algorithms can detect position-orientation and force-torque at landmark points for a given object set. The result is a modular sensing system that is highly scalable in terms of price, quantity, size and applications. Such skin technology and associated software can comprise a sensing package that integrates tactile and visual data with accompanying software for state estimation, situational awareness, and automatic control of machinery. The addition of tactile data can serve to constrain and/or augment visual pose estimation methods as well as provide pose estimation to visually occluded objects.

Abstract: Disclosed is a tactile sensing and integrated vision system that surmounts problems of existing systems. The tactile sensing skin can be formed into any shape, size, or form factor, including large areas. Computer-implemented algorithms can detect position-orientation and force-torque at landmark points for a given object set. The result is a modular sensing system that is highly scalable in terms of price, quantity, size and applications. Such skin technology and associated software can comprise a sensing package that integrates tactile and visual data with accompanying software for state estimation, situational awareness, and automatic control of machinery. The addition of tactile data can serve to constrain and/or augment visual pose estimation methods as well as provide pose estimation to visually occluded objects.

Abstract: Disclosed is a tactile sensing and integrated vision system that surmounts problems of existing systems. The tactile sensing skin can be formed into any shape, size, or form factor, including large areas. Computer-implemented algorithms can detect position-orientation and force-torque at landmark points for a given object set. The result is a modular sensing system that is highly scalable in terms of price, quantity, size and applications. Such skin technology and associated software can comprise a sensing package that integrates tactile and visual data with accompanying software for state estimation, situational awareness, and automatic control of machinery. The addition of tactile data can serve to constrain and/or augment visual pose estimation methods as well as provide pose estimation to visually occluded objects.

Abstract: Tactile sensors are disclosed that mimic the human fingertip and its touch receptors. The mechanical components are similar to a fingertip, with a rigid core surrounded by a weakly conductive fluid contained within an elastomeric skin. The deformable properties of the finger pad can be used as part of a transduction process. Multiple electrodes can be mounted on the surface of the rigid core and connected to impedance measuring circuitry within the core. External forces deform the fluid path around the electrodes, resulting in a distributed pattern of impedance changes containing information about those forces and the objects that applied them. Strategies are described for extracting features related to the mechanical inputs and using this information for reflexive grip control. Controlling grip force in a prosthetic having sensory feedback information is described. Techniques are described for enhancing the useful force range for impedance sensors by internally texturing the elastomeric skin.

Abstract: Tactile sensors are disclosed that mimic the human fingertip and its touch receptors. The mechanical components are similar to a fingertip, with a rigid core surrounded by a weakly conductive fluid contained within an elastomeric skin. The deformable properties of the finger pad can be used as part of a transduction process. Multiple electrodes can be mounted on the surface of the rigid core and connected to impedance measuring circuitry within the core. External forces deform the fluid path around the electrodes, resulting in a distributed pattern of impedance changes containing information about those forces and the objects that applied them. Strategies are described for extracting features related to the mechanical inputs and using this information for reflexive grip control. Controlling grip force in a prosthetic having sensory feedback information is described. Pressure transducers can provide sensory feedback by measuring micro-vibrations due to sliding friction.

Abstract: Disclosed is a robust tactile sensor array that mimics the human fingertip and its touch receptors. The mechanical components are similar to a fingertip, with a rigid core surrounded by a weakly conductive fluid contained within an elastomeric skin. It uses the deformable properties of the finger pad as part of the transduction process. Multiple electrodes are mounted on the surface of the rigid core and connected to impedance measuring circuitry within the core. External forces deform the fluid path around the electrodes, resulting in a distributed pattern of impedance changes containing information about those forces and the objects that applied them. Strategies for extracting features related to the mechanical inputs and using this information for reflexive grip control.