Patents by Inventor Nichole E. Nickel

Nichole E. Nickel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10770609
    Abstract: Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 8, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Patent number: 10759152
    Abstract: A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 1, 2020
    Assignee: dow global technologies llc
    Inventors: Jeffrey E Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Publication number: 20190123226
    Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 125° C., the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 25, 2019
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Publication number: 20190118517
    Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 25, 2019
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John a. Naumovitz, Mark G. Hofius
  • Publication number: 20140174509
    Abstract: Disclosed are multilayer film structures comprising a layer (B) that comprises a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), comprising i) an ethylene polymer (EP) comprising at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer comprising (a) an ethylene polymer block comprising at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that comprises a polyolefin having at least one melting peak greater than 1255 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably comprises (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules comprising an electronic device such as a PV cell.
    Type: Application
    Filed: June 28, 2012
    Publication date: June 26, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Jeffrey E. Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John A. Naumovitz, Mark G. Hofius
  • Publication number: 20140096825
    Abstract: A multilayer film structure comprising a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B comprises a crystalline block composite resin or a block composite resin and bottom Layer C comprises a polyolefin having at least one melting point greater than 125° C.
    Type: Application
    Filed: June 28, 2012
    Publication date: April 10, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Jeffrey E Bonekamp, Yushan Hu, Nichole E. Nickel, Lih-Long Chu, John a. Naumovitz, Mark G. Hofius
  • Patent number: 8431235
    Abstract: Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: April 30, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Lih-Long Chu, John Naumovitz, Nichole E. Nickel
  • Patent number: 8187685
    Abstract: The invention includes a composition comprising from 40 to 98 weight percent of at least one GPPS, from 0 to 98 weight percent of at least one HIPS, from 0.5 to 10 weight percent at least one styrene block copolymer, from 0.5 to 10 weight percent of at least one polypropylene wherein the combination of GPPS, HIPS, polypropylene and styrene block copolymer make up at least about 90 percent of the composition as well as a film made of the composition, an envelope window patch comprising the film, an envelope comprising the window patch, and a process for making the film.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: May 29, 2012
    Assignee: Dow Chemical Technologies LLC
    Inventors: Nichole E. Nickel, Eric K. Lee, Stephen J. Skapik, III, Donald J. Gromacki, Robert A. Gunther, James P. Maher
  • Publication number: 20110042448
    Abstract: The invention includes a composition comprising from at least 40 to 98 weight percent of at least one GPPS, from 0 to 98 weight percent of at least one HIPS, from at least 0.5 to 10 weight percent at least one styrene block copolymer, from at least 0.5 to 10 weight percent of at least one polypropylene wherein the combination of GPPS, HIPS, polypropylene and styrene block copolymer make up at least about 90 percent of the composition as well as a film made of the composition, an envelope window patch comprising the film, an envelope comprising the window patch, and a process for making the film.
    Type: Application
    Filed: July 23, 2007
    Publication date: February 24, 2011
    Inventors: Nichole E. Nickel, Eric K. Lee, Stephen J. Skapik, III, Donald J. Gromacki, Robert A. Gunther, James P. Maher
  • Publication number: 20100108128
    Abstract: Multilayer structures useful as a backsheet for an electronic device, e.g., a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e.g., ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e.g., an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125° C., e.g., a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.
    Type: Application
    Filed: November 4, 2009
    Publication date: May 6, 2010
    Inventors: Lih-Long Chu, John Naumovitz, Nichole E. Nickel