Abstract: A curable organopolysiloxane composition that is one component, has superior storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate usable time is provided. In particular, the composition has excellent curability even at temperatures of 80° C. or lower and excellent adhesion to resins such as polyester and polyphenylene sulfide. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a hydrosilylation reaction catalyst; (D) a condensation reaction catalyst or a condensation reaction product thereof selected from the group consisting of tetra-tert-butoxy titanium, di(isopropoxy)bis(ethyl acetoacetate)titanium, and an aluminum chelate complex; and (E) a curing inhibitor. When cured, the composition provides a silicone rubber composition with a JIS A hardness of 5 or higher.

Abstract: A metal aprotic organosilanoxide compound of formula (I): {R1—Si(R2)(R3)—[O—Si(R4)(R5)]m—O}n-M1(?L)o(X1)p (I), wherein M1 is a metal atom Al, Ce, Fe, or V, a composition or formulation containing or prepared from it, and methods of making and using them. Each molecule of the metal aprotic organosilanoxide compound is composed of at least one metal atom and at least one aprotic organosilanoxide ligand. The metal aprotic organosilanoxide compound may be used as such or as a constituent in a variety of silicone formulations for adhesives, coatings, elastomers, encapsulants, pottants, and sealants.

Abstract: A metal aprotic organosilanoxide compound of formula (I): {R1—Si(R2)(R3)—[O—Si(R4)(R5)]m—O}n-M1(?L)o(X1)p (I), wherein M1 is a metal atom Al, Ce, Fe, or V, a composition or formulation containing or prepared from it, and methods of making and using them. Each molecule of the metal aprotic organosilanoxide compound is composed of at least one metal atom and at least one aprotic organosilanoxide ligand. The metal aprotic organosilanoxide compound may be used as such or as a constituent in a variety of silicone formulations for adhesives, coatings, elastomers, encapsulants, pottants, and sealants.

Abstract: A curable formulation containing a metal aprotic organosilanoxide compound of formula (I): {R1—Si(R2)(R3)—[O—Si(R4)(R5)]m—O}n-M1(?L)o(X1)p (I), wherein M1 is a metal atom Al, Ce, Fe, Sn, Ti, V, or Zr, a polymerizable organosilicon compound, an organosilicon crosslinker for crosslinking the polymerizable organosilicon compound, and a silicon-based adhesion promoter. Also included is a cured product of curing the curable formulation; a manufactured article containing or prepared from the curable formulation or cured product; and methods of making and using the foregoing. The cured product may be free-standing or disposed on a substrate.

Abstract: A curable formulation containing a metal aprotic organosilanoxide compound of formula (I): {R1—Si(R2)(R3)—[O—Si(R4)(R5)]m—O}n-M1(?L)o(X1)p (I), wherein M1 is a metal atom Al, Ce, Fe, Sn, Ti, V, or Zr, a polymerizable organosilicon compound, an organosilicon crosslinker for crosslinking the polymerizable organosilicon compound, and a silicon-based adhesion promoter. Also included is a cured product of curing the curable formulation; a manufactured article containing or prepared from the curable formulation or cured product; and methods of making and using the foregoing. The cured product may be free-standing or disposed on a substrate.

Abstract: A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).

Abstract: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Abstract: A photovoltaic cell module, a photovoltaic array including at least two modules, and a method of forming the module are provided. The photovoltaic cell module includes a substrate and a tie layer disposed on the substrate. The tie layer has a depth of penetration of from 1.1 to 100 mm and a tack value of less than ?0.6 g·sec. The photovoltaic cell module also includes a photovoltaic cell disposed on the tie layer. The method of forming the photovoltaic cell module includes the steps of disposing the tie layer on the substrate and disposing the photovoltaic cell on the tie layer to form the photovoltaic cell module.

Abstract: Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

Abstract: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

Abstract: A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Abstract: This invention relates to a photovoltaic cell module and a process of applying a silicone based hot melt encapsulant material (102a, 104a) onto photovoltaic cells (103a) to form a photovoltaic cell module. There is provided a photovoltaic array with more efficient manufacturing and better utilization of the solar spectrum by using silicone hot melt sheets (102a, 104a) to give a silicone encapsulant photovoltaic device with the process ease of an organic encapsulant but the optical and chemical advantages of a silicone encapsulant. There is further provided a method for fabricating photovoltaic cells with increased throughput and optical efficiency when compared to prior art encapsulation methods. The preferred silicone material is provided in flexible sheet with hot melt properties and low surface tack.

Abstract: A cyclic organosilicon compound comprising one aliphatic unsaturation described by formula where each R is an independently selected hydrocarbon radical free from aliphatic unsaturation comprising 1 to about 18 carbon atoms; each X is independently selected from the group consisting of halogen, alkoxy, acyloxy, and ketoximo; m is an integer from 2 to 7; p is an integer from 0 to 6; m+p is an integer from 2 to 8; n is 0, 1, or 2; each Z is independently selected from the group consisting of divalent hydrocarbon radicals free of aliphatic unsaturation comprising about 2 to 18 carbon atoms and a combination of divalent hydrocarbon radicals and siloxane segments; and Y is selected from the group consisting of hydrocarbon radicals comprising one aliphatic unsaturation and 2 to about 18 carbon atoms and a combination comprising one aliphatic unsaturation of hydrocarbon radicals, siloxane segments, and a divalent hydrocarbon radical free of aliphatic unsaturation comprising 2 to about 18 carbo

Abstract: An organosilicon compound comprising one silicon-bonded hydrogen atom described by formula or by formula where each R1 and R1′ is an independently selected hydrocarbon radical free from aliphatic unsaturation comprising 1 to about 18 carbon atoms; each R2 is an independently selected hydrocarbon radical free from aliphatic unsaturation comprising 1 to about 18 carbon atoms; each X and X′ is independently selected from the group consisting of halogen, alkoxy, acyloxy, and ketoximo; t is 2 or 3; n is 0, 1, or 2; and each Z is independently selected from the group consisting of divalent hydrocarbon radicals free of aliphatic unsaturation comprising about 2 to 18 carbon atoms and a combination of divalent hydrocarbon radicals and siloxane segments. The organosilicon compounds comprising one silicon-bonded hydrogen atom of the present invention are useful as endcappers for polymers.

Abstract: A room temperature vulcanizing (RTV) silicone composition curable in the presence of moisture with rapid development of green strength. The RTV silicone composition comprises (A) 0 to about 85 weight percent polydiorganosiloxanes comprising on average at least 1.2 chain terminations per molecule selected from the group consisting of hydroxysilyl groups and alkoxysilyl groups; (B) about 10 to 95 weight percent polydiorganosiloxanes comprising on average at least 1.

Abstract: A cyclic organosilicon compound comprising one silicon-bonded hydrogen atom described by formula ##STR1## where each R is an independently selected hydrocarbon radical free from aliphatic unsaturation comprising 1 to about 18 carbon atoms; each X is independently selected from the group consisting of halogen, alkoxy, acyloxy, and ketoximo; m is an integer from 2 to 7; p is an integer from 0 to 6; m+p is an integer from 2 to 8; n is 0, 1, or 2; and each Z is independently selected from the group consisting of divalent hydrocarbon radicals free of aliphatic unsaturation comprising about 2 to 18 carbon atoms and a combination of divalent hydrocarbon radicals and siloxane segments. The cyclic organosilicon compounds comprising one silicon-bonded hydrogen atom of the present invention are useful as endcappers for polymers.

Abstract: A polyorganosiloxane comprising at least one organofunctional group per molecule having multiple hydrolyzable groups. The organofunctional group is described by formula --Z.sub.b --R.sup.4 (Z--SiR.sup.2.sub.n X.sub.3-n).sub.a, where each R.sup.2 is an independently selected monovalent hydrocarbon radical comprising 1 to about 18 carbon atoms; each Z is independently selected from the group consisting of divalent hydrocarbon radicals comprising about 2 to 18 carbon atoms and a combination of divalent hydrocarbon radicals and siloxane segments; R.sup.4 is independently selected from the group consisting of a silicon atom and a siloxane radical comprising at least two silicon atoms and each Z is bonded to a silicon atom of R.sup.4 with the remaining valences of the silicon atoms of R.sup.

Abstract: A silica filled room temperature vulcanizing (RTV) composition, curable in the presence of moisture and having good adhesion to glass and ceramic materials. The RTV composition comprises (A) about 20 to 95 weight percent polymers comprising on average at least 1.2 hydroxysilyl chain terminations per molecule or on average at least 1.2 alkoxysilyl chain terminations per molecule; (B) about 0.05 to 1.4 weight percent of a titanium compound; (C) a sufficient amount of an aminofunctional alkoxysilane to provide a nitrogen concentration from about 0.01 to 2 weight percent; (D) about 0.5 to 40 weight percent of an alkoxysilane; and (E) about 3 to 40 weight percent of a silica filler.

Abstract: An organosilicon compound comprising one aliphatic unsaturation described by formula ##STR1## where each R.sup.1 is an independently selected hydrocarbon radical free from aliphatic unsaturation comprising 1 to about 18 carbon atoms; each R.sup.

Abstract: A crosslinked polysiloxane dispersion comprising a siloxane polymer, polymer mixture, or polymer/solvent mixture, capable of crosslinking via condensation, addition or free radical reactions, and having a viscosity of greater than 5000 mPa.s but less than 500,000 mPa.s, if required, 0.1 to 10 weight parts of a crosslinking agent, and, if required, depending on the nature of the catalyst and silicon cure system, 0.000001 to 10 weight parts of a catalyst, 0.5 to 10 weight parts of a surfactant or surfactant mixture, and 0.5 to 25 weight parts water per 100 weight parts siloxane polymer. Optionally, adhesion promoters, pigments, reinforcing or non-reinforcing fillers, silicone resins, stabilizers, freeze/thaw additives, etc. may also be added to the dispersion.