Patents by Inventor Nick R. Bober

Nick R. Bober has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-card subsystem for embedded computing systems
    Patent number: 11071221
    Abstract: A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: July 20, 2021
    Assignee: General Dynamics Mission Systems, Inc.
    Inventors: Michael M. Holahan, Nick R. Bober
  • MULTI-CARD SUBSYSTEM FOR EMBEDDED COMPUTING SYSTEMS
    Publication number: 20200214153
    Abstract: A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.
    Type: Application
    Filed: December 26, 2018
    Publication date: July 2, 2020
    Inventors: Michael M. Holahan, Nick R. Bober
  • Integrated card rail and cooling module for embedded computing systems
    Patent number: 9999156
    Abstract: A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: June 12, 2018
    Assignee: General Dynamics Mission Systems, Inc.
    Inventors: Michael M. Holahan, Nick R. Bober
  • INTEGRATED CARD RAIL AND COOLING MODULE FOR EMBEDDED COMPUTING SYSTEMS
    Publication number: 20180124950
    Abstract: A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 3, 2018
    Inventors: Michael M. Holahan, Nick R. Bober