Patents by Inventor Nick Shephard

Nick Shephard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11685812
    Abstract: A composition contains an organopolysiloxane having the following average chemical structure: X3SiO—SiR2—R?—(R2SiO)x—R2Si—[Rb—(R2SiO)y—R2Si—Rb?—(R2SiO)z—R2Si]m—R?—R2SiO—SiX3; where X is —OSiR2—R?—R2SiO—R2Si—R?-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R?, R?, Rb and Rb? are divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: June 27, 2023
    Assignees: DOW SILICONES CORPORATION
    Inventors: Ryan Thomas, Nick Shephard, Gang Lu, Julia Sunderland
  • Publication number: 20230193097
    Abstract: A curable organopolysiloxane composition contains: (A) 100 mass parts of a functional organopolysiloxane component having at least one radical curable group selected from an acrylate group and a methacrylate group and optionally one or more alkoxysilyl groups; (B) 0 to 100 mass parts of a condensation curable organo polysiloxane component; (C) one to 10 mass parts of tetraalkoxysilanes or a hydrolyate of the tetraalkoxysilanes; and optionally one or more of (D) a radical initiator, (E) a condensation catalyst, (F) fillers, (G) adhesion promoters, (H) pigments, (I) a non-reactive organopolysiloxane, and (J) inhibitors.
    Type: Application
    Filed: August 30, 2021
    Publication date: June 22, 2023
    Inventors: Gang Lu, Julia Sunderland, Ryan Thomas, Cameron J. Kadleck, Duane R. Romer, Nick Shephard
  • Publication number: 20230174723
    Abstract: A composition contains an organopolysiloxane having the following average chemical structure: X3SiO—SiR2—R?—(R2SiO)x—R2Si—[Rb—(R2SiO)y—R2Si—Rb?—(R2SiO)z—R2Si]m—R?—R2SiO—SiX3; where X is —OSiR2—R?—R2SiO—R2Si—R?-A; R is an alkyl group having from 2 to 6 carbons and aryl groups; R?, R?, Rb and Rb? are divalent hydrocarbon groups comprising a chain of 2 to 6 methylene units; A is acrylate, methacrylate or trialkoxysilyl; provided that, on average, 60 to 90 mole-percent of the A groups are acrylate and methacrylate; Subscript m has an average value in a range of zero to 10; Subscripts x, y and z each has an average value in a range of zero to 1200; and provided that the average values of m, x, y and z are such that the sum of the average values for x, y and z is in a range of 300-1200 and the molar ratio of methylene units to siloxane units is less than 0.15.
    Type: Application
    Filed: August 30, 2021
    Publication date: June 8, 2023
    Inventors: Ryan Thomas, Nick Shephard, Gang Lu, Julia Sunderland
  • Publication number: 20230035408
    Abstract: Two-part condensation curable silyl-modified polymer (SMP) based sealant compositions, in particular two-part condensation curable SMP based translucent sealant compositions containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt.
    Type: Application
    Filed: December 17, 2019
    Publication date: February 2, 2023
    Inventors: Jiang PENG, Yi GUO, Nanguo LIU, Nick SHEPHARD, Ye WU
  • Publication number: 20230022605
    Abstract: One-part condensation curable silyl-modified polymer (SMP) based sealant compositions in particular one-part condensation curable SMP based sealant compositions containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which compositions upon cure provide elastomeric sealants having low modulus and a high elastic recovery.
    Type: Application
    Filed: December 17, 2019
    Publication date: January 26, 2023
    Inventors: Zhiping ZENG, Yi GUO, Nanguo LIU, Nick SHEPHARD, Xing WEI, Jiang PENG, Song GAO, Zhengming TANG, Hongyu CHEN
  • Publication number: 20230024520
    Abstract: A one-part room temperature vulcanisable (RTV) silicone composition containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which cures to a silicone elastomer which may be used as a clear sealant which avoids discolouration and loss of adhesion upon aging.
    Type: Application
    Filed: December 17, 2019
    Publication date: January 26, 2023
    Inventors: Jiang PENG, Yi GUO, Nanguo LIU, Nick SHEPHARD, Ye WU, Matt OLSEN
  • Publication number: 20230024747
    Abstract: A one-part low modulus room temperature vulcanisable (RTV) silicone composition containing a catalyst comprising (i) a titanate and/or zirconate and (ii) a metal carboxylate salt which cures to a low modulus silicone elastomer which may be used as a non-staining (clean) sealant having high movement capability.
    Type: Application
    Filed: December 17, 2019
    Publication date: January 26, 2023
    Inventors: Xiuyan WANG, Jiang PENG, Yi GUO, Qiang HU, Zhiping ZENG, Nanguo LIU, Nick SHEPHARD
  • Patent number: 11028297
    Abstract: A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 8, 2021
    Assignee: Dow Silicones Corporation
    Inventors: Gang Lu, Nick Shephard, Ryan Thomas, Matthew Olsen
  • Publication number: 20210002532
    Abstract: A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.
    Type: Application
    Filed: August 21, 2018
    Publication date: January 7, 2021
    Applicant: Dow Corning Corporation
    Inventors: Gang Lu, Nick Shephard, Ryan C. Thomas, Matthew Olsen
  • Publication number: 20200208033
    Abstract: A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.
    Type: Application
    Filed: August 21, 2018
    Publication date: July 2, 2020
    Applicant: Dow Corning Corporation
    Inventors: Gang Lu, Nick Shephard, Ryan C. Thomas, Matthew Olsen
  • Patent number: 9312416
    Abstract: An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 12, 2016
    Assignee: DOW CORNING CORPORATION
    Inventors: Mark Fisher, Don Juen, Barry Ketola, Nick Shephard
  • Publication number: 20150263208
    Abstract: An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain.
    Type: Application
    Filed: November 12, 2013
    Publication date: September 17, 2015
    Inventors: Mark Fisher, Don Juen, Barry Ketola, Nick Shephard
  • Publication number: 20150189867
    Abstract: Provided in various embodiments are methods of loading solid microparticles and nanoparticles of silver, including silver-based compounds, on silicone particles to surface modify the silicone particles. The silver-loaded microparticles and silver-loaded nanoparticles can be dispersed or loaded into silicones for use in antimicrobial and other applications.
    Type: Application
    Filed: March 14, 2013
    Publication date: July 9, 2015
    Applicant: Dow Corning Corporation
    Inventors: Laurie Kroupa, Donald Liles, Regina Malczewski, Shawn Mealey, Do-Lung Pan, Randall Schmidt, Nick Shephard, Christine Weber, Shengqing Xu
  • Patent number: 8859056
    Abstract: A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: October 14, 2014
    Assignee: Dow Corning Ireland, Ltd.
    Inventors: Liam O'Neill, Frederic Gubbels, Stuart Leadley, Nick Shephard
  • Patent number: 8618233
    Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1?)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1? is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: December 31, 2013
    Assignee: Dow Corning Corporation
    Inventors: Khristopher Alvarez, Nick Shephard, James Tonge
  • Patent number: 8334592
    Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: December 18, 2012
    Assignee: Dow Corning Corporation
    Inventors: Dorab Bhagwagar, Donald Liles, Nick Shephard, Shengqing Xu, Zuchen Lin, G. M. Fazley Elahee
  • Publication number: 20100328895
    Abstract: A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.
    Type: Application
    Filed: September 5, 2008
    Publication date: December 30, 2010
    Inventors: Dorab Bhagwagar, Donald Liles, Nick Shephard, Shengqing Xu, Zuchen Lin, G.M. Fazley Elahee
  • Publication number: 20100208432
    Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.
    Type: Application
    Filed: September 5, 2008
    Publication date: August 19, 2010
    Inventors: Dorab Bhagwagar, Donald Liles, Nick Shephard, Shengqing Xu, Zuchen Lin, G.M. Fazley Elahee
  • Publication number: 20100092690
    Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1?)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1? is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
    Type: Application
    Filed: November 7, 2007
    Publication date: April 15, 2010
    Applicant: DOW CORNING CORPORATION
    Inventors: Khristopher Alvarez, Nick Shephard, James Tonge
  • Publication number: 20090220794
    Abstract: A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.
    Type: Application
    Filed: May 10, 2006
    Publication date: September 3, 2009
    Inventors: Liam O'Neill, Frederic Gubbels, Stuart Leadley, Nick Shephard