Patents by Inventor Nick Valestrino

Nick Valestrino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielded label package and method of making the same
    Publication number: 20050067830
    Abstract: A plurality of die cut labels formed on a label substrate attached on the surface of a carrier for the die cut label substrate. A protective cover, preferably but not necessarily formed of transparent material, is adhesively secured over the die cut label substrate by way of a dry peel adhesive deposited on the surface of the die cut label substrate. The dry peel adhesive is such that when the protective cover is removed from the die cut label substrate, no tacky adhesive residue remains on the protective cover or the label substrate.
    Type: Application
    Filed: June 21, 2004
    Publication date: March 31, 2005
    Applicant: JDS Uniphase Corporation
    Inventors: Edward Mijdam, Nick Valestrino, Richard Florez