Patents by Inventor Nick Wagner

Nick Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240381803
    Abstract: Devices, systems, and method for generating agricultural guidance comprising defining a first non-straight path, mapping a second path adjacent to the first path, the second path having less than a threshold amount of crowding of the first non-straight path and less than a threshold amount of gap between the first non-straight path and second path, iteratively mapping subsequent paths path having less than a threshold amount of crowding of an adjacent pass and less than a threshold amount of gap between adjacent paths until a straight path is mapped, and commanding a steering system for traversal of the first non-straight path, second path, and subsequent paths.
    Type: Application
    Filed: May 15, 2024
    Publication date: November 21, 2024
    Inventor: Nick Wagner
  • Publication number: 20040215355
    Abstract: A modular system and method for programming machine automation controls is disclosed. The system includes a library of minor step modules and a procedure creator for creating a machine automation procedure from an assembly of the minor step modules. The system also includes a product type manager for inputting product parameters independent of the minor step modules, a system configuration manager for defining machine configuration independent of the minor step modules, and an execution engine for calling the procedure and maintaining information flow in and out of the minor step modules.
    Type: Application
    Filed: July 14, 2003
    Publication date: October 28, 2004
    Inventors: Dean Mills, Nick Wagner
  • Patent number: 6793125
    Abstract: A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: September 21, 2004
    Assignee: Meikle Automation Inc.
    Inventors: Paul Foley, Nick Wagner
  • Publication number: 20030038163
    Abstract: A process and apparatus for shaping the surface of a solid fusible material, such as solder, mounted on a substrate with the use of a tool having a treatment surface with the desired shape. The solid fusible material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.
    Type: Application
    Filed: July 15, 2002
    Publication date: February 27, 2003
    Inventors: Paul Foley, Nick Wagner