Patents by Inventor Nick WAKEFIELD

Nick WAKEFIELD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS die with a diaphragm having a stepped or tapered passage for ingress protection
    Patent number: 11716578
    Abstract: A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: August 1, 2023
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Vahid Naderyan, Sung Lee, Ankur Sharma, Nick Wakefield
  • MEMS DIE WITH A DIAPHRAGM HAVING A STEPPED OR TAPERED PASSAGE FOR INGRESS PROTECTION
    Publication number: 20220256292
    Abstract: A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.
    Type: Application
    Filed: February 11, 2021
    Publication date: August 11, 2022
    Inventors: Vahid NADERYAN, Sung LEE, Ankur SHARMA, Nick WAKEFIELD