Patents by Inventor Nick Zenner

Nick Zenner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10518517
    Abstract: Method and apparatus for lamination of substrates, e.g. rigid plastic layers, to manufacture laminated products. The methods include the sequential application of vacuum and mechanical force through a two-stroke process performed by a lamination apparatus having one or more force-producing stroke cylinders. Actuation of a cylinder to produce a first stroke creates a sealed chamber within the apparatus, enclosing a stack of substrates to be laminated. The sealed chamber may be evacuated of air by application of a vacuum. Subsequent actuation of a cylinder to produce a second stroke applies mechanical force to the sealed chamber, which compresses the substrates into a laminated product substantially free of air bubbles or voids.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: December 31, 2019
    Assignee: PerkinElmer Health Sciences, Inc.
    Inventors: Reed Simmons, Tatsuya Minakawa, Michael Corliss, Alan Swan, Nick Zenner, Emily Fanucci
  • Publication number: 20170182758
    Abstract: Method and apparatus for lamination of substrates, e.g. rigid plastic layers, to manufacture laminated products. The methods include the sequential application of vacuum and mechanical force through a two-stroke process performed by a lamination apparatus having one or more force-producing stroke cylinders. Actuation of a cylinder to produce a first stroke creates a sealed chamber within the apparatus, enclosing a stack of substrates to be laminated. The sealed chamber may be evacuated of air by application of a vacuum. Subsequent actuation of a cylinder to produce a second stroke applies mechanical force to the sealed chamber, which compresses the substrates into a laminated product substantially free of air bubbles or voids.
    Type: Application
    Filed: March 27, 2015
    Publication date: June 29, 2017
    Inventors: Reed Simmons, Tatsuya Minakawa, Michael Corliss, Alan Swan, Nick Zenner, Emily Fanucci