Abstract: The invention relates to a configurable radio frequency, RF, system, which comprises a first RF module; and a second RF module. Each of the first and the second RF module comprises: an RF circuitry, a signal path, in particular a waveguide, and an RF port connected to the respective RF signal path; wherein the RF port of the first RF module and the RF port of the second RF module are spaced apart at a predetermined distance and are oriented to enable a connection to a third RF module of the configurable RF system.

Abstract: The invention relates to configurable radio frequency, RF, system. The RF system comprises: a first RF module which comprises a signal path and an RF port; wherein the RF port is arranged for being connected to a further RF module or to a device-under-test, DUT; wherein the first RF module further comprises at least a first and a second auxiliary port which are accessible from outside the first RF module; wherein the first and the second auxiliary port are arranged for being connected to each other via: a first bridging element or a first extension module of the configurable RF system; and wherein the signal path is connected to the RF port and passes through: the first auxiliary port, the first bridging element or the first extension module, and the second auxiliary port.

Abstract: The present disclosure provides an electrical contact sleeve comprising a circumferential electrical conductor configured to couple to an outer conductor of an electrically conducting coaxial element at least along a predetermined section of the circumference of the outer conductor, and at least one electrical contact extending from the circumferential electrical conductor and comprising a contacting surface configured to contact an electrically conductive surface of a carrier substrate. In addition, the present disclosure provides a respective RF module and a respective method.

Abstract: A circuit module comprising a printed circuit board, PCB, arrangement, a connection module, CM, and a high frequency circuit carrier, HFCC, are provided. The HFCC is arranged on the PCB arrangement. The CM is mounted on the PCB arrangement. The CM comprises at least one connection pad and is configured to electrically connect a metallic structure on or in the printed circuit board to the connection pad of the CM. The HFCC comprises at least one connection pad. At least one bond wire is provided to electrically connect the at least one connection pad to the HFCC to the at least one connection pad of the CM. The CM has a height over the PCB so that the at least one connection pad of the HFCC and at least one connection pad of the CM are on a same level or have a height difference that is less than 2 mm, preferably less than 1 mm, most preferably less than 0.8 mm.

Abstract: A measurement system is provided. Said measurement system comprises a first measurement chain, a second measurement chain, a radio frequency hybrid coupler, a first radio frequency port connected to the first measurement chain via the radio frequency hybrid coupler, a second radio frequency port connected to the second measurement chain via the radio frequency hybrid coupler, a first attenuator or a first radio frequency switch for the first radio frequency port, and a second attenuator or a second radio frequency switch for the second radio frequency port. In this context, a first transmission coefficient of the first attenuator or the first radio frequency switch is controllable. In addition to this, a second transmission coefficient of the second attenuator or the second radio frequency switch is controllable.

Abstract: The present disclosure provides a power calibration adapter for wafer probers, the power calibration adapter comprising at least one first landing pad, for releasably contacting a wafer prober tip of the wafer prober, and a power meter interface for each one of the first landing pads that is coupled to the at least one first landing pad and that is configured to couple the at least one first landing pad to a power measurement device. Further, the present disclosure provides a respective Zo measurement application system and a respective method.

Abstract: A circuit module comprising a printed circuit board, PCB, arrangement, a connection module, CM, and a high frequency circuit carrier, HFCC, are provided. The HFCC is arranged on the PCB arrangement. The CM is mounted on the PCB arrangement. The CM comprises at least one connection pad and is configured to electrically connect a metallic structure on or in the printed circuit board to the connection pad of the CM. The HFCC comprises at least one connection pad. At least one bond wire is provided to electrically connect the at least one connection pad to the HFCC to the at least one connection pad of the CM. The CM has a height over the PCB so that the at least one connection pad of the HFCC and at least one connection pad of the CM are on a same level or have a height difference that is less than 2 mm, preferably less than 1 mm, most preferably less than 0.8 mm.

Abstract: An antenna system comprises at least one antenna, a feeding line and a cable guide for a line not feeding the at least one antenna. The at least one antenna has a feeding portion to which the feeding line is assigned. The cable guide has an opening that is provided in the feeding portion.

Abstract: An antenna system comprises at least one antenna, a feeding line and a cable guide for a line not feeding the at least one antenna. The at least one antenna has a feeding portion to which the feeding line is assigned. The cable guide has an opening that is provided in the feeding portion.