Abstract: An integrated circuit includes a semiconductor substrate, electronic components integrated in the semiconductor substrate, an electric connection structure overlying the semiconductor substrate, and an conductive region, with elongated shaped, having a first and a second end. The conductive region is formed in the electric connection structure, extends over an entire length of the substrate and is not directly electrically connected to the electronic components. A first and a second synchronization connection element are electrically coupled to the first end and to the second end, respectively, of the conductive region and have each a respective synchronization connection portion facing the coupling face.

Abstract: An electronic device has a plurality of integrated circuits fixed to a support between transmitting and receiving antennas. An integrated circuit generates a synchronization signal supplied to the other integrated circuits. Each integrated circuit is formed in a die integrating electronic components and overlaid by a connection region according to the Flip-Chip Ball-Grid-array or embedded Wafer Level BGA. A plurality of solder balls for each integrated circuit is electrically coupled to the electronic components and bonded between the respective integrated circuit and the support. The solder balls are arranged in an array, aligned along a plurality of lines parallel to a direction, wherein the plurality of lines comprises an empty line along which no solder balls are present. A conductive synchronization path is formed on the support and extends along the empty line of at least one integrated circuit, between the solder balls of the latter.

Abstract: An electronic device has a plurality of integrated circuits fixed to a support between transmitting and receiving antennas. An integrated circuit generates a synchronization signal supplied to the other integrated circuits. Each integrated circuit is formed in a die integrating electronic components and overlaid by a connection region according to the Flip-Chip Ball-Grid-array or embedded Wafer Level BGA. A plurality of solder balls for each integrated circuit is electrically coupled to the electronic components and bonded between the respective integrated circuit and the support. The solder balls are arranged in an array, aligned along a plurality of lines parallel to a direction, wherein the plurality of lines comprises an empty line along which no solder balls are present. A conductive synchronization path is formed on the support and extends along the empty line of at least one integrated circuit, between the solder balls of the latter.

Abstract: A method, includes: providing at least one set of data; composing a data stream including compressed data from the at least one set of data, the at least one set of data having embedded therein a respective counter indicative of the at least one set of data, the respective counter being losslessly encoded into the compressed data; transmitting the data stream over a transmission channel; receiving the data stream; and recovering, from the data stream, the respective counter.

Abstract: A method, includes: storing at least one set of data in a memory space, wherein the at least one set of data stored has a memory footprint in the memory space; and coupling, to the at least one set of data, a respective counter indicative of the at least one set of data, wherein the respective counter is embedded in the at least one set of data without increasing the memory footprint in the memory space.

Abstract: An electronic device has a plurality of integrated circuits fixed to a support between transmitting and receiving antennas. An integrated circuit generates a synchronization signal supplied to the other integrated circuits. Each integrated circuit is formed in a die integrating electronic components and overlaid by a connection region according to the Flip-Chip Ball-Grid-array or embedded Wafer Level BGA. A plurality of solder balls for each integrated circuit is electrically coupled to the electronic components and bonded between the respective integrated circuit and the support. The solder balls are arranged in an array, aligned along a plurality of lines parallel to a direction, wherein the plurality of lines comprises an empty line along which no solder balls are present. A conductive synchronization path is formed on the support and extends along the empty line of at least one integrated circuit, between the solder balls of the latter.

Abstract: An integrated circuit includes a semiconductor substrate, electronic components integrated in the semiconductor substrate, an electric connection structure overlying the semiconductor substrate, and an conductive region, with elongated shaped, having a first and a second end. The conductive region is formed in the electric connection structure, extends over an entire length of the substrate and is not directly electrically connected to the electronic components. A first and a second synchronization connection element are electrically coupled to the first end and to the second end, respectively, of the conductive region and have each a respective synchronization connection portion facing the coupling face.

Abstract: A method, includes: providing at least one set of data; composing a data stream including compressed data from the at least one set of data, the at least one set of data having embedded therein a respective counter indicative of the at least one set of data, the respective counter being losslessly encoded into the compressed data; transmitting the data stream over a transmission channel; receiving the data stream; and recovering, from the data stream, the respective counter

Abstract: A method, includes: storing at least one set of data in a memory space, wherein the at least one set of data stored has a memory footprint in the memory space; and coupling, to the at least one set of data, a respective counter indicative of the at least one set of data, wherein the respective counter is embedded in the at least one set of data without increasing the memory footprint in the memory space.

Abstract: A protective coating is applied to a thermally reactive material layer in laminate manner. The coating includes a fluorocarbon sizing agent which causes beading of any adverse material and prevents penetration thereof into the thermally reactive material. A combined color developing and dye formulation includes bisphenol, wax, clay and dye in a binder of polyvinyl alcohol which effects a spreading of any adverse material on the surface of the coating.

Abstract: A liquid internal phase for use in encapsulated particles to produce high intensity marks includes an organic solvent having a specific amount of colorless chromogenic material and a larger amount of alkylated benzene material to yield a blue mark, and a specific amount of colorless chromogenic material and a lesser amount of alkylated benzene material to yield a black mark.

Abstract: A carbonless CFB paper includes an aqueous wax emulsion added to the CB coating to act as a barrier between the reactants in the CB coating and in the CF coating, thereby preventing precolor caused by reactants seeping into or penetrating the base paper and reacting with any ruptured capsules in the CB coating.

Abstract: Minute capsules having a pearlescent effect are obtained by incorporating inorganic pearlescent particles in the capsule walls during the manufacture thereof. Pearlescent particles of mica coated with titanium dioxide are initially dispersed in an oily internal phase material and then flushed into the aqueous coacervation phase upon addition of the internal phase to an encapsulation medium. The pearlescent particles remain embedded in the capsule wall material and provide the pearlescent effect to the finished capsules.