Abstract: The present invention relates to a semiconductor laser having at least one quantum film in which electron hole pairs can be recombined, having at least two barrier layers between which respectively one of the at least one quantum films is disposed adjacently to these, directly in a planar manner or via respectively one intermediate film, and also having a pump device, the barrier layers having or consisting of AlzGa1-zAsySb1-y, with y greater than or equal to zero and less than or equal to one and z less than or equal to one and greater than 0.4, and/or having or consisting of AlzGauInvAsySb1-y, with z+u+v=1 and z greater than 0.25, the electron hole pairs being able to be produced directly in the quantum film with the pump device.

Abstract: A semiconductor device which provides a small and simple design with efficient cooling. A first electrically conducting cooling element is in contact with first electrodes of semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the first electrodes of the semiconductor elements to an external apparatus. A second electrically conducting cooling element is in contact with second electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the second electrodes of the semiconductor elements to an external apparatus. The semiconductor device includes an interface which is electrically connected to gates of the semiconductor elements for external control of respective states of the semiconductor elements.

Abstract: A power semiconductor module including a semiconductor device (e.g., an insulated gate bipolar transistor (IGBT), a reverse conductive (RC IGBT), or a bi-mode insulated gate transistor (BIGT)) with an emitter electrode and a collector electrode is provided. An electrically conductive upper layer is sintered to the emitter electrode. The upper layer is capable of forming an eutecticum with the semiconductor of the semiconductor device, and has a coefficient of thermal expansion which differs from the coefficient of thermal expansion of the semiconductor in a range of ?250%, for example ?50%. An electrically conductive base plate is sintered to the collector electrode. The semiconductor module includes an electrically conductive area which is electrically isolated from the base plate and connected to the upper layer via a direct electrical connection. The semiconductor module is easy to prepare, has an improved reliability and exhibits short circuit failure mode capacity.

Abstract: A semiconductor device which provides a small and simple design with efficient cooling. A first electrically conducting cooling element is in contact with first electrodes of semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the first electrodes of the semiconductor elements to an external apparatus. A second electrically conducting cooling element is in contact with second electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the second electrodes of the semiconductor elements to an external apparatus. The semiconductor device includes an interface which is electrically connected to gates of the semiconductor elements for external control of respective states of the semiconductor elements.

Abstract: Exemplary embodiments of the disclosure are directed to a circuit arrangement in which a power functional device and a conductor element are mounted and a method of manufacturing the same. The arrangement includes a substrate, a wiring layer provided on the substrate and electrically connected to the functional device and to the conductor element and an intermediate electric contact device. The intermediate electric contact device is mounted on the wiring layer to provide on the side opposite to the wiring layer a contact region for contacting the conductor element. The conductor element is contacting the intermediate electric contact device in the contact region which is opposite to an area, in which the electric contact device is fixed to the wiring layer.

Abstract: The present invention relates to a semiconductor laser having at least one quantum film in which electron hole pairs can be recombined, having at least two barrier layers between which respectively one of the at least one quantum films is disposed adjacently to these, directly in a planar manner or via respectively one intermediate film, and also having a pump device, the barrier layers having or consisting of AlzGa1-zAsySbi-y, with y greater than or equal to zero and less than or equal to one and z less than or equal to one and greater than 0.4, and/or having or consisting of AlzGauInvAsySb1-y, with z+u+v=1 and z greater than 0.25, the electron hole pairs being able to be produced directly in the quantum film with the pump device.