Patents by Inventor Nicolae Bordeanu

Nicolae Bordeanu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220403128
    Abstract: A thermally expandable composition includes at least one epoxy-functional polymer, at least one endothermic chemical blowing agent, at least one free radical initiator, and at least one guanidine derivative. The invention is also related to a baffle and/or a reinforcement element for hollow structures including the thermally expandable composition, to a process for manufacturing the baffle and/or the reinforcement element, to use of the baffle and/or the reinforcement element for sealing, baffling, or reinforcing of a cavity or a hollow structure, and to a method for sealing, baffling and/or reinforcing a cavity or hollow structure.
    Type: Application
    Filed: August 17, 2020
    Publication date: December 22, 2022
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Dusko PARIPOVIC, Nicolae BORDEANU, Loic ZINGRAFF
  • Publication number: 20220372239
    Abstract: A thermally expandable composition includes at least one epoxy-functional polymer, at least one endothermic chemical blowing agent, and at least one curative selected from the group made of a urea, urea derivatives, guanidine derivatives, amidine derivatives, and imidazoles. Further, a baffle and/or a reinforcement element for hollow structures includes the thermally expandable composition, a process manufactures the baffle and/or the reinforcement element, the baffle and/or the reinforcement element is used for sealing, baffling, or reinforcing of a cavity or a hollow structure, and a method seals, baffles and/or reinforces a cavity or hollow structure.
    Type: Application
    Filed: August 17, 2020
    Publication date: November 24, 2022
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Dusko PARIPOVIC, Loic ZINGRAFF, Nicolae BORDEANU
  • Patent number: 11447599
    Abstract: A one-component thermosetting epoxy resin composition, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; c) at least one physical or chemical blowing agent BA; d) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR1 with a Mooney Viscosity of 15-30 MU (Mooney units), based on the total amount of epoxy resin A; and e) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR2 with a Mooney Viscosity of 35-50 MU (Mooney units), based on the total amount of epoxy resin A. The ratio of ABR1 to ABR2 is from 0.5-2.0. The epoxy resin adhesive is notable for the improved storage stability.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: September 20, 2022
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Nicolae Bordeanu, Leslie Wolschleger
  • Publication number: 20220227955
    Abstract: A thermally expandable composition comprising a thermoplastic polymer compound and/or an elastomer compound, at least one blowing agent including at least one dicarboxylic acid salt of an aminoguanidine compound, optionally at least one free radical initiator and/or a vulcanization system, and at least one guanidine derivative. The invention is also related to baffle and/or a reinforcement element for hollow structures including the thermally expandable composition, to a process for manufacturing the baffle and/or reinforcement element, to use of the baffle and/or reinforcement element for sealing, baffling, or reinforcing of a cavity or a hollow structure, and to a method for sealing, baffling and/or reinforcing a cavity or hollow structure.
    Type: Application
    Filed: June 12, 2020
    Publication date: July 21, 2022
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Nicolae BORDEANU, Shunsuke YAMADA, Dusko PARIPOVIC
  • Patent number: 11377532
    Abstract: A thermally expandable composition, including at least one epoxy-functional polymer, at least one thermoplastic polymer, at least one chemical blowing agent, and at least one activator, wherein the epoxy-functional polymer is present in the composition before expansion with an amount of between 30 and 75 wt.-%, based on the total composition, and the epoxy-functional polymer includes at least 300 mmol epoxy groups per kg polymer, and wherein the chemical blowing agent is able to form at least one reaction product with at least two amino groups upon thermal decomposition, and the chemical blowing agent is in the composition before expansion with an amount of between 5 and 30 wt.-%, based on the total composition.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 5, 2022
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Geng Lin, Leslie Wolschleger, Nicolae Bordeanu
  • Publication number: 20210292470
    Abstract: A one-component thermosetting epoxy resin composition, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; c) at least one physical or chemical blowing agent BA; d) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR1 with a Mooney Viscosity of 15-30 MU (Mooney units), based on the total amount of epoxy resin A; and e) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR2 with a Mooney Viscosity of 35-50 MU (Mooney units), based on the total amount of epoxy resin A. The ratio of ABR1 to ABR2 is from 0.5-2.0. The epoxy resin adhesive is notable for the improved storage stability.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Nicolae BORDEANU, Leslie WOLSCHLEGER
  • Publication number: 20190276624
    Abstract: A thermally expandable composition, including at least one epoxy-functional polymer, at least one thermoplastic polymer, at least one chemical blowing agent, and at least one activator, wherein the epoxy-functional polymer is present in the composition before expansion with an amount of between 30 and 75 wt.-%, based on the total composition, and the epoxy-functional polymer includes at least 300 mmol epoxy groups per kg polymer, and wherein the chemical blowing agent is able to form at least one reaction product with at least two amino groups upon thermal decomposition, and the chemical blowing agent is in the composition before expansion with an amount of between 5 and 30 wt.-%, based on the total composition.
    Type: Application
    Filed: July 19, 2017
    Publication date: September 12, 2019
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Geng LIN, Leslie WOLSCHLEGER, Nicolae BORDEANU
  • Publication number: 20170342230
    Abstract: A chemical blowing agent is described that includes at least one tertiary alkyl carbamate. The chemical blowing agent can be activated thermally and is suitable for foaming thermoplastic materials and can, for example, be incorporated into thermally expandable baffle and/or reinforcement elements, which can be used in automotive manufacturing and building insulation.
    Type: Application
    Filed: December 18, 2015
    Publication date: November 30, 2017
    Inventors: Nicolae BORDEANU, Rui XU-RABL, Urs BURCKHARDT
  • Publication number: 20150252165
    Abstract: The present invention relates to expandable compositions in the form of granular materials that are based on epoxy resins with a content of binders and curing agents for curing the epoxy resin. Corresponding compositions can be readily introduced into hollow bodies, for example, into sticks or roof supports and expanded to a foam by heating the composition and cured. This results in hollow bodies filled with foam that are distinguished by significantly improved mechanical properties compared to comparable hollow bodies without a foam filling. At the same time, the granular materials according to the invention can be very readily processed without a complex and expensive two-component injection-molding process being necessary.
    Type: Application
    Filed: November 6, 2013
    Publication date: September 10, 2015
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Karsten Frick, Nicolae Bordeanu, Frank Hoefflin