Patents by Inventor Nicolai Petrov

Nicolai Petrov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120314171
    Abstract: In one or more embodiments, display devices having electrolessly plated conductors and methods are disclosed. One such embodiment is directed to a method of forming a reflective pixel array for a display device, including forming a plurality of conductive pads, each of the conductive pads corresponding to a reflective pixel, and electrolessly plating each of the conductive pads with a reflective conductor.
    Type: Application
    Filed: June 8, 2011
    Publication date: December 13, 2012
    Inventors: Anurag Jindal, Kunal Parekh, Prashant Raghu, Nicolai Petrov, Mark Meldrim
  • Patent number: 7615491
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 10, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Patent number: 7611988
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Patent number: 7611987
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 3, 2009
    Assignee: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Publication number: 20090155468
    Abstract: Electrolessly depositing a cobalt-based alloy on a metal surface of a substrate in a process which involves monitoring for Co3+ ion concentration in a sample of the electroless cobalt deposition composition during said contacting; and replacing or regenerating the electroless cobalt deposition composition when the concentration of Co3+ ions exceeds a predetermined concentration of Co3+ ions.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Applicant: ENTHONE INC.
    Inventors: Nicolai Petrov, Paul Figura, Qingyun Chen, Charles Valverde, Richard Hurtubise
  • Publication number: 20080254205
    Abstract: A method and composition for electrolessly depositing a layer of a metal alloy onto a surface of a metal substrate in manufacture of microelectronic devices. The composition comprises a source of metal deposition ions, a borane-based reducing agent, and a two-component stabilizer, wherein the first stabilizer component is a source of hypophosphite and the second stabilizer component is a molybdenum (VI) compound.
    Type: Application
    Filed: April 13, 2007
    Publication date: October 16, 2008
    Applicant: ENTHONE INC.
    Inventors: Nicolai Petrov, Charles Valverde, Qingyun Chen, Richard Hurtubise
  • Patent number: 7410899
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: August 12, 2008
    Assignee: Enthone, Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Patent number: 7332193
    Abstract: An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: February 19, 2008
    Assignee: Enthone, Inc.
    Inventors: Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Jr., Richard Hurtubise, Christian Witt
  • Publication number: 20070062408
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Publication number: 20070066059
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubies
  • Publication number: 20070066058
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: October 5, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Publication number: 20070066057
    Abstract: Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 22, 2007
    Applicant: Enthone Inc.
    Inventors: Qingyun Chen, Charles Valverde, Vincent Paneccasio, Nicolai Petrov, Daniel Stritch, Christian Witt, Richard Hurtubise
  • Publication number: 20060280860
    Abstract: An electroless plating method and composition for depositing Co or Co alloys onto a metal-based substrate in manufacture of microelectronic devices, involving a source of Co ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and an oxime-based compound stabilizer.
    Type: Application
    Filed: June 9, 2005
    Publication date: December 14, 2006
    Applicant: Enthone Inc.
    Inventors: Vincent Paneccasio, Qingyun Chen, Charles Valverde, Nicolai Petrov, Christian Witt, Richard Hurtubise
  • Publication number: 20060083850
    Abstract: An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.
    Type: Application
    Filed: March 21, 2005
    Publication date: April 20, 2006
    Applicant: Enthone Inc.
    Inventors: Charles Valverde, Nicolai Petrov, Eric Yakobson, Qingyun Chen, Vincent Paneccasio, Richard Hurtubise, Christian Witt
  • Patent number: 6911067
    Abstract: An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing agent, which reduces the first-metal ions into the first metal on the substrate, a complexing agent for keeping the first-metal ions in the solution, and a source of ions of a second element for generation of second-metal ions that improve the corrosion resistance of the aforementioned coating.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: June 28, 2005
    Assignee: Blue29, LLC
    Inventors: Artur Kolics, Nicolai Petrov, Chiu Ting, Igor C. Ivanov
  • Patent number: 6902605
    Abstract: The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical characteristics, when the Co—Cu system layer is used in IC chips. The composition of the electroless solution contains more than one reducing agents, one of which can catalyze the initial electroless deposition layer of cobalt on copper (called initiator), while the other maintains deposition of cobalt on the aforementioned initial layer as the process is continued. Small amount (100-5000 ppm) of elements from the initiator also builds into the electroless film, which is expected to further improve the barrier properties of the resultant film compared to the deposition bath without initiator.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: June 7, 2005
    Assignee: Blue29, LLC
    Inventors: Artur Kolics, Nicolai Petrov, Chiu Ting, Igor Ivanov
  • Patent number: 6875691
    Abstract: A sequence of temperature control in electroless plating for microelectronic processing is disclosed in this invention. This sequence improves the uniformity of the deposit, increases the lifetime of the plating bath and is cost effective. The plating bath is heated to a temperature, which is lower than the minimum deposition temperature, in an apparatus outside the plating chamber. Then the solution is introduced into the plating chamber without the occurrence of the deposition. After the chamber is filled, the solution is heated up to the desired deposition temperature. The deposition is initialized. After the deposition, the solution is returned back to the original tank.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: April 5, 2005
    Assignee: Mattson Technology, Inc.
    Inventors: Nanhai Li, Nicolai Petrov, Artur Kolics
  • Patent number: 6794288
    Abstract: The method for selective deposition of Co—W—P system films onto copper with palladium-free activation consists of creating hydrogen-rich complexes on the metal surface prior to deposition. More specifically, the method consists of creating the aforementioned complexes on the copper surfaces prior to electroless deposition of a Co—W—P system films. This is achieved by contacting the copper surface with reducing agents for a short period of time and under an elevated temperature. Such reducing agents comprise a hypophosphorous-acid-based or borane-based reducing agents such as dimethylamine borane. Hypophosphorous acid is preferred since it is more compatible with the electroless deposition solution.
    Type: Grant
    Filed: May 5, 2003
    Date of Patent: September 21, 2004
    Assignee: Blue29 Corporation
    Inventors: Artur Kolics, Nicolai Petrov, Chiu Ting, Igor C. Ivanov
  • Publication number: 20040175509
    Abstract: The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical characteristics, when the Co—Cu system layer is used in IC chips. The composition of the electroless solution contains more than one reducing agents, one of which can catalyze the initial electroless deposition layer of cobalt on copper (called initiator), while the other maintains deposition of cobalt on the aforementioned initial layer as the process is continued. Small amount (100-5000 ppm) of elements from the initiator also builds into the electroless film, which is expected to further improve the barrier properties of the resultant film compared to the deposition bath without initiator.
    Type: Application
    Filed: March 6, 2003
    Publication date: September 9, 2004
    Inventors: Artur Kolics, Nicolai Petrov, Chiu Ting, Igor Ivanov
  • Publication number: 20040134375
    Abstract: An electroless deposition solution of the invention for forming an alkali-metal-free coating on a substrate comprises a first-metal ion source for producing first-metal ions, a pH adjuster in the form of a hydroxide for adjusting the pH of the solution, a reducing agent, which reduces the first-metal ions into the first metal on the substrate, a complexing agent for keeping the first-metal ions in the solution, and a source of ions of a second element for generation of second-metal ions that improve the corrosion resistance of the aforementioned coating.
    Type: Application
    Filed: January 10, 2003
    Publication date: July 15, 2004
    Inventors: Artur Kolics, Nicolai Petrov, Chiu Ting, Igor Ivanov