Patents by Inventor Nicolas ARLT

Nicolas ARLT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250301919
    Abstract: A method of manufacturing a superconducting integrated circuit device includes providing a Josephson Junction (JJ) structure on a first structured superconducting layer arranged on a substrate. Forming a cover layer over the first structured superconducting layer, including forming a first component from a sacrificial material in a first region of the cover layer, the first component surrounding the JJ structure with at least a portion of a top surface of the JJ structure, facing away from the substrate, being uncovered by the sacrificial material, and forming a second component from a first dielectric material in a second region of the cover layer. A via is formed in the cover layer over a portion of the first structured superconducting layer. A second structured superconducting layer is formed overlaying the top surface of the JJ structure and the via. The sacrificial material is removed.
    Type: Application
    Filed: March 13, 2025
    Publication date: September 25, 2025
    Inventors: Jochen BRAUMÜLLER, Michael KIRSCH, Wolfgang RABERG, Jash BANKER, Nicolas ARLT
  • Publication number: 20250160221
    Abstract: A method of manufacturing a superconductive integrated circuit on a substrate includes forming a first superconductive layer of a superconductive material over the substrate. A Josephson junction (JJ) layer stack including a JJ barrier layer is formed over the first superconductive layer. The JJ layer stack is structured to form a JJ structure. The first superconductive layer is structured to form a structured first superconductive layer. A dielectric cover layer is formed over the JJ structure. The dielectric cover layer is structured a first time to expose an upper side of the JJ structure. A second superconductive layer of a superconductive material is formed over the dielectric cover layer. The second superconductive layer is structured to form a structured second superconductive layer.
    Type: Application
    Filed: October 31, 2024
    Publication date: May 15, 2025
    Inventors: Wolfgang RABERG, Michael KIRSCH, Jash BANKER, Jochen BRAUMÜLLER, Nicolas ARLT
  • Publication number: 20240357947
    Abstract: An electronic circuit includes a substrate and a superconducting electronic circuit unit which is constructed on the substrate. The superconducting electronic circuit unit includes a capacitor with parallel plates opposite one another and a crystalline capacitor dielectric arranged between the parallel plates.
    Type: Application
    Filed: April 15, 2024
    Publication date: October 24, 2024
    Inventors: Jochen BRAUMÜLLER, Florian BRANDL, Michael KIRSCH, Wolfgang RABERG, Nicolas ARLT, Jash BANKER, Patrick HANEKAMP