Patents by Inventor Nicolas Arnal

Nicolas Arnal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer assembly for MEMS fabrication
    Patent number: 11823943
    Abstract: A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: November 21, 2023
    Assignee: Memjet Technology Limited
    Inventors: Nicolas Arnal, Troy Pasiola Quimpo, Angus North
  • WAFER ASSEMBLY FOR MEMS FABRICATION
    Publication number: 20220285201
    Abstract: A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.
    Type: Application
    Filed: May 9, 2022
    Publication date: September 8, 2022
    Inventors: Nicolas ARNAL, Troy Pasiola QUIMPO, Angus NORTH
  • Process for handling MEMS wafers
    Patent number: 11355383
    Abstract: A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: June 7, 2022
    Inventors: Nicolas Arnal, Troy Pasiola Quimpo, Angus North
  • PROCESS FOR HANDLING MEMS WAFERS
    Publication number: 20200381284
    Abstract: A process for handling MEMS wafers includes the steps of: (i) attaching a first carrier substrate to a first side of a MEMS wafer, the first carrier substrate being attached via a first wafer bonding tape and a silicone-free peel tape, the peel tape contacting the first side of the MEMS wafer; (ii) performing wafer processing steps on an opposite second side of the MEMS wafer; (iii) releasing the first carrier substrate from the first side of the MEMS wafer via exposure to an energy source, the energy source selectively releasing the wafer bonding tape from the first side of the MEMS wafer; and (iv) peeling the peel tape away from the first side of the MEMS wafer.
    Type: Application
    Filed: June 1, 2020
    Publication date: December 3, 2020
    Inventors: Nicolas Arnal, Troy Pasiola Quimpo, Angus North