Patents by Inventor Nicolas D. Huffman

Nicolas D. Huffman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11518971
    Abstract: A three-dimensional cell growth containment article is described, which includes a molded body channelized by removal of sacrificial channelizing element(s) therefrom, so that the molded body contains one or more channel(s) therein, with a matrix material in at least one of such channel(s) that is supportive of three-dimensional cell growth in the matrix material. A method for making such articles is also described, in which a molded body is formed with one or more sacrificial channelizing element(s) therein, following which the sacrificial channelizing element(s) are removed. The three-dimensional cell growth containment articles of the present disclosure may be utilized in any applications in which there exists a need to reproducibly generate three-dimensional cellular structures, e.g.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: December 6, 2022
    Assignee: RESEARCH TRIANGLE INSTITUTE
    Inventors: Leah Marie Johnson, Ninell Pollas Mortensen, Ginger Denison Rothrock, Nicolas D. Huffman
  • Publication number: 20200165555
    Abstract: A three-dimensional cell growth containment article is described, which includes a molded body channelized by removal of sacrificial channelizing element(s) therefrom, so that the molded body contains one or more channel(s) therein, with a matrix material in at least one of such channel(s) that is supportive of three-dimensional cell growth in the matrix material. A method for making such articles is also described, in which a molded body is formed with one or more sacrificial channelizing element(s) therein, following which the sacrificial channelizing element(s) are removed. The three-dimensional cell growth containment articles of the present disclosure may be utilized in any applications in which there exists a need to reproducibly generate three-dimensional cellular structures, e.g.
    Type: Application
    Filed: November 26, 2019
    Publication date: May 28, 2020
    Inventors: Leah Marie Johnson, Ninell Pollas Mortensen, Ginger Denison Rothrock, Nicolas D. Huffman
  • Patent number: 8142687
    Abstract: A method for selecting materials and processing conditions to prepare a heterogeneous structure in situ via the reaction of a homogeneous mixture of a reactive organic compound and a filler, which may then optionally be sintered. The method is employed to provide a heterogeneous composite possessing exceptionally high thermal and/or electrically conductivities for a given concentration of conductive filler. The choice of materials as well as processing conditions employed, as will be described below, have a strong effect on the rate domain formation/heterogeneity of the structure formed, the extent of filler particle-particle interactions within filler-rich domains, and ultimately the thermal and/or electrical conductivity. Proper choice of these conditions can lead to composites having enhanced properties at a reduced bulk filler concentration.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: March 27, 2012
    Assignee: Lord Corporation
    Inventors: Timothy D. Fornes, Nicolas D. Huffman
  • Patent number: 7968624
    Abstract: A highly filled system is provided which employs the combination of coated filler particles and a compatibilizer to allow extremely high filler loading while maintaining a low viscosity. The compositions of the present invention allows a filler level which was previously unachievable due to the increase in viscosity which is particularly evident when extremely small (nanometer sized) filler is added to a system containing conventional (micron sized) filler particles. This is accomplished through selection of a coating for the filler and selection of a compatibilizer which improves the affinity between the filler and the polymer, thereby improving nanometer sized filler wetting and dispersion and allowing the filler to be incorporated into the polymer matrix.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: June 28, 2011
    Assignee: LORD Corporation
    Inventors: Timothy D. Fornes, Nicolas D. Huffman
  • Publication number: 20110049416
    Abstract: A method for selecting materials and processing conditions to prepare a heterogeneous structure in situ via the reaction of a homogeneous mixture of a reactive organic compound and a filler, which may then optionally be sintered. The method is employed to provide a heterogeneous composite possessing exceptionally high thermal and/or electrically conductivities for a given concentration of conductive filler. The choice of materials as well as processing conditions employed, as will be described below, have a strong effect on the rate domain formation/heterogeneity of the structure formed, the extent of filler particle-particle interactions within filler-rich domains, and ultimately the thermal and/or electrical conductivity. Proper choice of these conditions can lead to composites having enhanced properties at a reduced bulk filler concentration.
    Type: Application
    Filed: November 8, 2010
    Publication date: March 3, 2011
    Inventors: TIMOTHY D. FORNES, Nicolas D. Huffman
  • Publication number: 20110014356
    Abstract: A method for protecting a substrate from lightning strikes is provided including providing a lightning strike protectant composition to the substrate. The lightning strike protectant composition comprises a reactive organic compound and a conductive filler that, during the cure of the organic compound, is capable of self-assembling into a heterogeneous structure comprised of a continuous, three-dimensional network of metal situated among (continuous or semi-continuous) polymer rich domains. The resulting composition has exceptionally high thermal and electrical conductivity.
    Type: Application
    Filed: June 11, 2010
    Publication date: January 20, 2011
    Applicant: LORD Corporation
    Inventors: TIMOTHY D. FORNES, SETH B. CARRUTHERS, NICOLAS D. HUFFMAN
  • Publication number: 20100001237
    Abstract: A method for selecting materials and processing conditions to prepare a heterogeneous structure in situ via the reaction of a homogeneous mixture of a reactive organic compound and a filler, which may then optionally be sintered. The method is employed to provide a heterogeneous composite possessing exceptionally high thermal and/or electrically conductivities for a given concentration of conductive filler. The choice of materials as well as processing conditions employed, as will be described below, have a strong effect on the rate domain formation/heterogeneity of the structure formed, the extent of filler particle-particle interactions within filler-rich domains, and ultimately the thermal and/or electrical conductivity. Proper choice of these conditions can lead to composites having enhanced properties at a reduced bulk filler concentration.
    Type: Application
    Filed: March 26, 2008
    Publication date: January 7, 2010
    Inventors: Timothy D. Fornes, Nicolas D. Huffman
  • Publication number: 20080111111
    Abstract: A highly filled system is provided which employs the combination of coated filler particles and a compatibilizer to allow extremely high filler loading while maintaining a low viscosity. The compositions of the present invention allows a filler level which was previously unachievable due to the increase in viscosity which is particularly evident when extremely small (nanometer sized) filler is added to a system containing conventional (micron sized) filler particles. This is accomplished through selection of a coating for the filler and selection of a compatibilizer which improves the affinity between the filler and the polymer, thereby improving nanometer sized filler wetting and dispersion and allowing the filler to be incorporated into the polymer matrix.
    Type: Application
    Filed: October 23, 2007
    Publication date: May 15, 2008
    Inventors: TIMOTHY D. FORNES, NICOLAS D. HUFFMAN