Abstract: An electronic and/or computer device of the computer server type includes: circuit boards and a power supply unit which provides electrical power to various elements of the electronic device. The power supply unit has a fluidtight enclosure, filled with dielectric fluid capable of collecting heat from various components of the power supply unit in order to release it to a heat exchange wall, and is removable. The device includes a two-phase heat transfer circuit with capillary pumped loop having an evaporator thermally coupled to the heat exchange wall of the power supply unit, and a condenser located at a distance from the power supply unit and thermally coupled to a general thermal collector, such that, when in the working position, the heat exchange zone is pressed against the evaporator.

Abstract: A computer assembly, having a generally parallelepiped shape with regard to a set of three orthogonal axis XYZ, includes a mother board and an auxiliary board, a first cooling loop with a first heat-intake exchanger in contact with at least one processing unit of the mother board, and a first heat-discharge exchanger, and fluid connections, a second cooling loop with a second heat-intake exchanger in contact with at least one processing unit of the auxiliary board, and a second heat-discharge exchanger, and fluid connections. The first heat-discharge exchanger comprises a first strength member extending at least along a plane XZ and a plurality of first air-cooled fins. The second heat-discharge exchanger comprises a second strength member extending at least along a plane YZ a plurality of second air-cooled fins. The first strength member is fixed to the second strength member to form thereby the structural chassis of the computer assembly.

Abstract: An electronic and/or computer device of the computer server type includes: circuit boards and a power supply unit which provides electrical power to various elements of the electronic device. The power supply unit has a fluidtight enclosure, filled with dielectric fluid capable of collecting heat from various components of the power supply unit in order to release it to a heat exchange wall, and is removable. The device includes a two-phase heat transfer circuit with capillary pumped loop having an evaporator thermally coupled to the heat exchange wall of the power supply unit, and a condenser located at a distance from the power supply unit and thermally coupled to a general thermal collector, such that, when in the working position, the heat exchange zone is pressed against the evaporator.

Abstract: The invention particularly relates to a computer device (700) for a computer housing center that is transportable in a container. The computer device includes at least one computer cabinet. Said computer device is sized and arranged so as to be movable inside a container into which said computer device is to be placed, and which comprises an absorber system that is suitable, with regard to said computer device, for absorbing the transmission of vibrations to the at least one computer cabinet once the computer device is installed in the container.

Abstract: A heat sink for an interchangeable expansion module that can be connected to a computer board is disclosed. In one aspect, the heat sink has at least one cooling module in which a coolant flows, and at least one first electrical connector. The heat sink, wherein the expansion module has at least one second electrical connector configured to be connected to the first electrical connector of the board, and has at least one heat exchange surface, the heat sink comprising at least one heat-transfer device configured to be removably placed against the exchange surface, and the heat-transfer device further being configured such that it is in thermal contact with the cooling module and is mechanically attached, in a removable manner, to the cooling module of the board when the expansion module is connected to the board is also disclosed.

Abstract: The invention relates to a heat sink for an interchangeable expansion module that can be connected to a computer board, said heat sink having at least one cooling module in which a coolant flows, and at least one first electrical connector, wherein said expansion module (4) has at least one second electrical connector configured to be connected to said first electrical connector of said board, and has at least one heat-exchange surface (18, 19), said heat sink (20) comprising at least one heat-transfer device (21) configured to be removably placed against said exchange surface (18, 19), and said device (21) further being configured such that it is in thermal contact with said cooling module and is mechanically attached, in a removable manner, to said cooling module of said board when said extension module (4) is connected to said board.

Abstract: The invention particularly relates to a computer device (700) for a computer housing center that is transportable in a container. The computer device includes at least one computer cabinet. Said computer device is sized and arranged so as to be movable inside a container into which said computer device is to be placed, and which comprises an absorber system that is suitable, with regard to said computer device, for absorbing the transmission of vibrations to the at least one computer cabinet once the computer device is installed in the container.